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A circuit model for carbon nanotube interconnects: comparative study with Cu interconnects for scaled technologies

Published:07 November 2004Publication History

ABSTRACT

Semiconducting carbon nanotubes (CNT) have gained immense popularity as possible successors to silicon as the channel material for ultra high performance field effect transistors. On the other hand, their metallic counterparts have often been regarded as ideal interconnects for the future technology generations. Owing to their high current densities and increased reliability, metallic-single walled CNTs (SWCNTs) have been subjects of fundamental research both in theory as well as experiments. Metallic CNTs have been modeled for RF applications in (Burke, 2003) using an LC model. We present an efficient circuit compatible RLC model for metallic SW CNTs, and analyze the impact of SW CNTs on the performance of ultra scaled digital VLSI design.

References

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  1. A circuit model for carbon nanotube interconnects: comparative study with Cu interconnects for scaled technologies

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    • Published in

      cover image ACM Conferences
      ICCAD '04: Proceedings of the 2004 IEEE/ACM International conference on Computer-aided design
      November 2004
      913 pages
      ISBN:0780387023

      Publisher

      IEEE Computer Society

      United States

      Publication History

      • Published: 7 November 2004

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      Overall Acceptance Rate457of1,762submissions,26%

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