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High-throughput decoder for low-density parity-check code
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Source with EDA Technofair Design Automation Conference Asia and South Pacific archive
Proceedings of the 2006 conference on Asia South Pacific design automation table of contents
Yokohama, Japan
SESSION: University design contest table of contents
Pages: 112 - 113  
Year of Publication: 2006
ISBN:0-7803-9451-8
Authors
Tatsuyuki Ishikawa  Waseda University, Hibikino, Wakamatsuku, Kitakyushushi, Fukuoka, Japan
Kazunori Shimizu  Waseda University, Hibikino, Wakamatsuku, Kitakyushushi, Fukuoka, Japan
Takeshi Ikenaga  Waseda University, Hibikino, Wakamatsuku, Kitakyushushi, Fukuoka, Japan
Satoshi Goto  Waseda University, Hibikino, Wakamatsuku, Kitakyushushi, Fukuoka, Japan
Sponsors
: IEEE Circuits and Systems Society
SIGDA: ACM Special Interest Group on Design Automation
IEICE ESS : Institute of Electronics, Information and Communication Engineers, Engineering Sciences Society
IPSJ SIG-SLDM : Information Processing Society of Japan, SIG System LSI Design Methodology
Publisher
IEEE Press  Piscataway, NJ, USA
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ABSTRACT

We have designed and implemented the LDPC decoder chip with memory-reduction method to achieve high-throughput and practical chip size. The decoder decodes (3,6)-2304bit regular LDPC codes using modified min-sum algorithm. The decoder achieves a throughput of 530Mb/s at an operating frequency of 147MHz. The chip has been fabricated in a 0.18μm, 6 metal-layer CMOS technology. The chip size is 36mm2.



Collaborative Colleagues:
Tatsuyuki Ishikawa: colleagues
Kazunori Shimizu: colleagues
Takeshi Ikenaga: colleagues
Satoshi Goto: colleagues