Adaptive admittance-based conductor meshing for interconnect analysis

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Adaptive admittance-based conductor meshing for interconnect analysis

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with EDA Technofair Design Automation Conference Asia and South Pacific archive
Proceedings of the 2006 conference on Asia South Pacific design automation table of contents

Yokohama, Japan

SESSION: High frequency interconnect effects in nanometer technology table of contents

Pages: 509 - 514

Year of Publication: 2006

ISBN:0-7803-9451-8

Authors

Ya-Chi Yang	Purdue University, West Lafayette, IN
Cheng-Kok Koh	Purdue University, West Lafayette, IN
Venkataramanan Balakrishnan	Purdue University, West Lafayette, IN

Sponsors

: IEEE Circuits and Systems Society
SIGDA: ACM Special Interest Group on Design Automation
IEICE ESS : Institute of Electronics, Information and Communication Engineers, Engineering Sciences Society
IPSJ SIG-SLDM : Information Processing Society of Japan, SIG System LSI Design Methodology

Publisher

IEEE Press Piscataway, NJ, USA

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ABSTRACT

We present a new algorithm for discretizing interconnects, a step that is typically performed to account for the nonuniformity of current flow at high frequencies. The algorithm is based on an easily-computable measure that correlates well with the model accuracy. This measure is used to refine the discretization of interconnects in an adaptive scheme so as to systematically trade off computation against model accuracy. We apply the proposed discretization technique on two classes of problems in the analysis of VLSI interconnects: simulation and frequency-dependent inductance extraction. Numerical results establish that with the interconnect discretizations generated by our algorithm, a reduction in simulation and extraction times by a factor between three and seven can be realized with negligible sacrifice in model accuracy (< 1% error).

REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

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