ACM Home Page
Please provide us with feedback. Feedback
Evaluation of on-chip transmission line interconnect using wire length distribution
Full text PdfPdf (522 KB)
Source with EDA Technofair Design Automation Conference Asia and South Pacific archive
Proceedings of the 2005 conference on Asia South Pacific design automation table of contents
Shanghai, China
SESSION: Routing and interconnects table of contents
Pages: 133 - 138  
Year of Publication: 2005
ISBN:0-7803-8737-6
Authors
Junpei Inoue  Tokyo Institute of Technology, Midori-ku, Yokohama, Japan
Hiroyuki Ito  Tokyo Institute of Technology, Midori-ku, Yokohama, Japan
Shinichiro Gomi  Tokyo Institute of Technology, Midori-ku, Yokohama, Japan
Takanori Kyogoku  Tokyo Institute of Technology, Midori-ku, Yokohama, Japan
Takumi Uezono  Tokyo Institute of Technology, Midori-ku, Yokohama, Japan
Kenichi Okada  Tokyo Institute of Technology, Midori-ku, Yokohama, Japan
Kazuya Masu  Tokyo Institute of Technology, Midori-ku, Yokohama, Japan
Sponsors
SIGDA: ACM Special Interest Group on Design Automation
: Shanghai IC Industry Association
: IEEE SSCS Shanghai Chapter
: IEEE CAS
: IEEE Beijing Section
: Fudan University
: Chinese Institute of Electronics
Publisher
ACM  New York, NY, USA
Bibliometrics
Downloads (6 Weeks): 2,   Downloads (12 Months): 27,   Citation Count: 2
Additional Information:

abstract   references   cited by   collaborative colleagues  

Tools and Actions: Review this Article  
Save this Article to a Binder    Display Formats: BibTex  EndNote ACM Ref   
DOI Bookmark: Use this link to bookmark this Article: http://doi.acm.org/10.1145/1120725.1120789
What is a DOI?

ABSTRACT

On-chip transmission-line interconnect has been proposed to reduce delay time and power consumption. The transmission line is used to replace long RC interconnects. This paper proposes the methodology to replace RC lines with transmission lines, which are estimated with Wire Length Distribution (WLD). Advantages of on-chip transmission line are discussed from the view point of delay time and power consumption.


REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

 
1
S. Gomi, K. Nakamura, H. Ito, K. Okada, and K. Masu, "Differential Transmission Line Interconnect for High Speed and Low Power Global Wiring," Proc. IEEE Custom Integrated Circuits Conference, pp. 325--328, 2004.
 
2
H. Ito, K. Nakamura, K. Okada and K. Masu, "High Density Differential Transmission Line Structure on Si USLI", IEICE Transactions on Electronics, Vol. E87-C, No. 6, pp. 942--948, June 2004.
 
3
J. A. Davis, V. K. De, and J. D. Meindl, "A Stochastic Wire Length Distribution for Gigascale Integration (GSI): Part I: Derivation and Validation," IEEE Trans. on Electron Devices, Vol. 45, No. 3, pp. 580--589, 1998.
 
4
H. B. Bakoglu, "Circuits, Intreconnections, and Packaging for VLSI." Reading. MA: Addision-Wesley, 1990.
 
5
S. Wong, T. G. Lee, D. Ma, and C. Chao, "An Empirical Three-Dimensional Crossover Capacitance Model for Multilevel Interconnect VLSI Circuits," IEEE Trans Semiconductor Manufacturing, vol. 13, no. 2, pp. 219--227, May 2000.
 
6
C. K. Cheng, J. Lillis, S. Lin, and N. Chang, "Interconnect Analysis and Synthesis," A Wiley-Interscience Publication., 2000.

Collaborative Colleagues:
Junpei Inoue: colleagues
Hiroyuki Ito: colleagues
Shinichiro Gomi: colleagues
Takanori Kyogoku: colleagues
Takumi Uezono: colleagues
Kenichi Okada: colleagues
Kazuya Masu: colleagues