| Evaluation of on-chip transmission line interconnect using wire length distribution |
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with EDA Technofair Design Automation Conference Asia and South Pacific
archive
Proceedings of the 2005 conference on Asia South Pacific design automation
table of contents
Shanghai, China
SESSION: Routing and interconnects
table of contents
Pages: 133 - 138
Year of Publication: 2005
ISBN:0-7803-8737-6
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Authors
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Junpei Inoue
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Tokyo Institute of Technology, Midori-ku, Yokohama, Japan
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Hiroyuki Ito
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Tokyo Institute of Technology, Midori-ku, Yokohama, Japan
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Shinichiro Gomi
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Tokyo Institute of Technology, Midori-ku, Yokohama, Japan
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Takanori Kyogoku
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Tokyo Institute of Technology, Midori-ku, Yokohama, Japan
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Takumi Uezono
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Tokyo Institute of Technology, Midori-ku, Yokohama, Japan
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Kenichi Okada
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Tokyo Institute of Technology, Midori-ku, Yokohama, Japan
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Kazuya Masu
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Tokyo Institute of Technology, Midori-ku, Yokohama, Japan
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| Bibliometrics |
Downloads (6 Weeks): 2, Downloads (12 Months): 27, Citation Count: 2
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ABSTRACT
On-chip transmission-line interconnect has been proposed to reduce delay time and power consumption. The transmission line is used to replace long RC interconnects. This paper proposes the methodology to replace RC lines with transmission lines, which are estimated with Wire Length Distribution (WLD). Advantages of on-chip transmission line are discussed from the view point of delay time and power consumption.
REFERENCES
Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.
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S. Gomi, K. Nakamura, H. Ito, K. Okada, and K. Masu, "Differential Transmission Line Interconnect for High Speed and Low Power Global Wiring," Proc. IEEE Custom Integrated Circuits Conference, pp. 325--328, 2004.
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J. A. Davis, V. K. De, and J. D. Meindl, "A Stochastic Wire Length Distribution for Gigascale Integration (GSI): Part I: Derivation and Validation," IEEE Trans. on Electron Devices, Vol. 45, No. 3, pp. 580--589, 1998.
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H. B. Bakoglu, "Circuits, Intreconnections, and Packaging for VLSI." Reading. MA: Addision-Wesley, 1990.
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S. Wong, T. G. Lee, D. Ma, and C. Chao, "An Empirical Three-Dimensional Crossover Capacitance Model for Multilevel Interconnect VLSI Circuits," IEEE Trans Semiconductor Manufacturing, vol. 13, no. 2, pp. 219--227, May 2000.
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C. K. Cheng, J. Lillis, S. Lin, and N. Chang, "Interconnect Analysis and Synthesis," A Wiley-Interscience Publication., 2000.
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CITED BY 2
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Takumi Uezono , Junpei Inoue , Takanori Kyogoku , Kenichi Okada , Kazuya Masu, Prediction of delay time for future LSI using on-chip transmission line interconnects, Proceedings of the 2005 international workshop on System level interconnect prediction, April 02-03, 2005, San Francisco, California, USA
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