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Microarchitecture evaluation with floorplanning and interconnect pipelining
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Source with EDA Technofair Design Automation Conference Asia and South Pacific archive
Proceedings of the 2005 conference on Asia South Pacific design automation table of contents
Shanghai, China
SESSION: (Special session) CAD for microarchitecture designs table of contents
Pages: 8 - 15  
Year of Publication: 2005
ISBN:0-7803-8737-6
Authors
Ashok Jagannathan  Univ. of California, Los Angeles, CA
Hannah Honghua Yang  Intel Corporation, Hillsboro, OR
Kris Konigsfeld  Intel Corporation, Hillsboro, OR
Dan Milliron  Intel Corporation, Hillsboro, OR
Mosur Mohan  Intel Corporation, Hillsboro, OR
Michail Romesis  Univ. of California, Los Angeles, CA
Glenn Reinman  Univ. of California, Los Angeles, CA
Jason Cong  Univ. of California, Los Angeles, CA
Sponsors
SIGDA: ACM Special Interest Group on Design Automation
: Shanghai IC Industry Association
: IEEE SSCS Shanghai Chapter
: IEEE CAS
: IEEE Beijing Section
: Fudan University
: Chinese Institute of Electronics
Publisher
ACM  New York, NY, USA
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Downloads (6 Weeks): 1,   Downloads (12 Months): 32,   Citation Count: 8
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ABSTRACT

As microprocessor technology continues to scale into the nanometer regime, recent studies show that interconnect delay will be a limiting factor for performance, and multiple cycles will be necessary to communicate global signals across the chip. Thus, longer interconnects need to be pipelined, and the impact of the extra latency along wires needs to be considered during early micro-architecture design exploration. In this paper, we address this problem and make the following contributions: (1) a oor plan-driven micro-architecture evaluation methodology considering interconnect pipelining at a given target frequency by selectively optimizing architecture level critical paths. (2) use of micro-architecture performance sensitivity models to weight micro-architectural critical paths during oor planning and optimize them for higher performance. (3) a methodology to study the impact of frequency scaling on micro-architecture performance with consideration of interconnect pipelining.For a sample micro-architecture design space, we show that considering interconnect pipelining can increase the estimated performance against a no-wire-pipelining approach between 25% to 45%. We also demonstrate the value of the methodology in exploring the target frequency of the processor.


REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

 
1
M. Bohr, "Interconnect Scaling - The Real Limiter to High-Performance ULSI," in Tech. Dig. of the International Electron Devices Meeting, pp. 241--244, Dec. 1995.
 
2
R. Ho, K. W. Mai, and M. A. Horowitz, "The Future of Wires," in IEEE, vol. 89, pp. 490--504, April 2001.
 
3
J. Cong, "An Interconnect-Centric Design Flow for Nanometer Technologies," in Proceedings of IEEE, pp. 505--527, April 2001.
 
4
G. Hinton, D. Sager, M. Upton, D. Boggs, D. Carmean, A. Kyker, and P. Roussel, "The Microarchitecture of the Pentium 4 Processor," Intel Technology Journal Q1, 2001.
5
6
7
8
9
 
10
M. Rewienski and J. White, "A Trajectory Piecewise Linear Approach to Model Order Reduction and Fast Simulation of Nonlinear Circuits and Micromachined Devices," in IEEE Trans. on Computer Aided Design, pp. 155--170, 2003.
 
11
12
 
13
D. Carmean Intel Corporation, Personal Communication.
14
 
15
S. Wilton and N. Jouppi, "CACTI: An Enhanced Cache Access and Cycle Time Model," in IEEE Journal of Solid-State Circuits, May 1996.
16
 
17
D. C. Burger and T. M. Austin, "The SimpleScalar Tool Set, Version 2.0," Technical Report CS-TR-97-1342, University of Wisconsin, Madison, June 1997.
 
18
 
19
 
20
 
21
S. Kirkpatrick, C. D. Gelatt, and M. P. Vecchi, "Optimization by Simulated Annealing," Science, Number 4598, 13 May 1983, vol. 220, 4598, pp. 671--680, 1983.
 
22
H. Murata, F. Fujiyoshi, S. Nakatake, and Y. Kajitani, "VLSI Module Placement on Rectangle Packing by Sequence-Pair," IEEE Transactions on Computer-Aided Design, vol. 15, pp. 1518--1524, Dec 1996.
 
23
 
24
"The Standard Performance Evaluation Corporation," 2000. http://www.spec.org.
25
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CITED BY  8
 
 
 
 
Collaborative Colleagues:
Ashok Jagannathan: colleagues
Hannah Honghua Yang: colleagues
Kris Konigsfeld: colleagues
Dan Milliron: colleagues
Mosur Mohan: colleagues
Michail Romesis: colleagues
Glenn Reinman: colleagues
Jason Cong: colleagues