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Statistical modeling of cross-coupling effects in VLSI interconnects
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Source with EDA Technofair Design Automation Conference Asia and South Pacific archive
Proceedings of the 2005 conference on Asia South Pacific design automation table of contents
Shanghai, China
SESSION: Interconnect modeling and analysis and system level design methodology table of contents
Pages: 503 - 506  
Year of Publication: 2005
ISBN:0-7803-8737-6
Authors
Mridul Agarwal  Indian Institute of Technology, Kanpur
Kanak Agarwal  University of Michigan, Ann Arbor
Dennis Sylvester  University of Michigan, Ann Arbor
David Blaauw  University of Michigan, Ann Arbor
Sponsors
SIGDA: ACM Special Interest Group on Design Automation
: Shanghai IC Industry Association
: IEEE SSCS Shanghai Chapter
: IEEE CAS
: IEEE Beijing Section
: Fudan University
: Chinese Institute of Electronics
Publisher
ACM  New York, NY, USA
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ABSTRACT

In this paper, we develop an approach for statistical modeling of crosstalk noise and dynamic delay degradation in coupled RC interconnects under process variations. The proposed model enables closed-form computation of mean and variance of noise peak and worst case dynamic delay for given variabilities in physical dimensions. We compare the proposed model against HSPICE Monte Carlo simulations and report an average error in mean and standard deviation of noise peak to be 2.7% and 3.7% respectively.


REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

 
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S. R. Nassif, "Modeling and Analysis of Manufacturing Variations," CICC, pp. 223--2228, 2001.
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W. C. Elmore, "The Transient Response of Damped Linear Networks with Particular Regard to Wideband Amplifiers," J. Applied Physics, v.19, pp. 55--63, Jan. 1948.
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F. Liu, C. Kashyap, and C. J. Alpert, "A Delay Metric for RC Circuits based on the Weibull Distribution," DAC, pp. 382--385, 2003.
 
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L. Ding, D. Blaauw and P. Mazumder, "Accurate Crosstalk Noise Modeling for Early Signal Integrity," IEEE Trans. CAD, vol. 22, no. 5, pp. 627--634, May 2003.
 
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T. Sato, Y. Cao, K. Agarwal, D. Sylvester and C. Hu, "Bidirectional Closed-Form Transformation between On-Chip Coupling Noise Waveforms and Interconnect Delay-Change Curves," IEEE Trans. CAD, v. 22, no. 5, May 2003.
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Collaborative Colleagues:
Mridul Agarwal: colleagues
Kanak Agarwal: colleagues
Dennis Sylvester: colleagues
David Blaauw: colleagues