| Statistical modeling of cross-coupling effects in VLSI interconnects |
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with EDA Technofair Design Automation Conference Asia and South Pacific
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Proceedings of the 2005 conference on Asia South Pacific design automation
table of contents
Shanghai, China
SESSION: Interconnect modeling and analysis and system level design methodology
table of contents
Pages: 503 - 506
Year of Publication: 2005
ISBN:0-7803-8737-6
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Downloads (6 Weeks): 4, Downloads (12 Months): 39, Citation Count: 1
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ABSTRACT
In this paper, we develop an approach for statistical modeling of crosstalk noise and dynamic delay degradation in coupled RC interconnects under process variations. The proposed model enables closed-form computation of mean and variance of noise peak and worst case dynamic delay for given variabilities in physical dimensions. We compare the proposed model against HSPICE Monte Carlo simulations and report an average error in mean and standard deviation of noise peak to be 2.7% and 3.7% respectively.
REFERENCES
Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.
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L. Ding, D. Blaauw and P. Mazumder, "Accurate Crosstalk Noise Modeling for Early Signal Integrity," IEEE Trans. CAD, vol. 22, no. 5, pp. 627--634, May 2003.
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Andrew B. Kahng , Sudhakar Muddu , Egino Sarto, On switch factor based analysis of coupled RC interconnects, Proceedings of the 37th conference on Design automation, p.79-84, June 05-09, 2000, Los Angeles, California, United States
[doi> 10.1145/337292.337318]
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T. Sato, Y. Cao, K. Agarwal, D. Sylvester and C. Hu, "Bidirectional Closed-Form Transformation between On-Chip Coupling Noise Waveforms and Interconnect Delay-Change Curves," IEEE Trans. CAD, v. 22, no. 5, May 2003.
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