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Delay and peak power minimization for on-chip buses using temporal redundancy
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Source Great Lakes Symposium on VLSI archive
Proceedings of the 16th ACM Great Lakes symposium on VLSI table of contents
Philadelphia, PA, USA
POSTER SESSION: Poster session 1 table of contents
Pages: 119 - 122  
Year of Publication: 2006
ISBN:1-59593-347-6
Authors
K. Najeeb  Indian Institute of Technology Madras, Chennai, India
Vishal Gupta  Indian Institute of Technology Madras, Chennai, India
V. Kamakoti  Indian Institute of Technology Madras, Chennai, India
Sponsors
ACM: Association for Computing Machinery
SIGDA: ACM Special Interest Group on Design Automation
Publisher
ACM  New York, NY, USA
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ABSTRACT

In this paper, we propose a novel temporal redundancy based encoding technique for delay and peak power minimization. The proposed encoding scheme is tested with the SPEC2000 CINT benchmarks for 90nm and 65nm technologies. The experimental results show that our approach is very effective in reducing the peak power. From the delay perspective, our approach reduces the delay by at least 11% (4%) in the address (data) buses compared to the data transmission without encoding.


REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

 
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Berkeley predictive technology model. http://www-device.eecs.berkeley.edu/~ptm/interconnect.html
 
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SimpleScalar Toolset. http://www.simplescalar.com.
 
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SPEC CPU2000 Benchmark. http://www.spec.org
 
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International Technology Roadmap for Semiconductors, 2001. http://public.itrs.net
 
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F. Caignet et al. "The Challenge of Signal Integrity in Deep-submicrometer CMOS Technology". IEEE, 89(4), 2001, pp. 556--573.
 
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C.-G. Lyuh et al. "Low Power Bus Encoding with Crosstalk Delay Elimination". In ASIC/SOC, 2002, pp. 389--393.
 
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P. Sotiriadis et al. "Low Power Bus Coding Techniques Considering Inter-wire Capacitances". In CICC, 2000, pp. 507--510.
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D. Sylvester et al. "Analytical Modeling and Characterization of Deep-submicrometer Interconnect". IEEE, 89(5), 2001, pp. 634--664.
 
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Collaborative Colleagues:
K. Najeeb: colleagues
Vishal Gupta: colleagues
V. Kamakoti: colleagues