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Exploring "temperature-aware" design in low-power MPSoCs

Authors:

L. BeniniAuthors Info & Claims

DATE '06: Proceedings of the conference on Design, automation and test in Europe: Proceedings

Pages 838 - 843

Published: 06 March 2006 Publication History

Abstract

The power density inside high performance systems continues to rise with every process technology generation, thereby increasing the operating temperature and creating "hot spots" on the die. As a result, the performance, reliability and power consumption of the system degrade. To avoid these "hot spots", "temperature-aware" design has become a must. For low-power embedded systems though, it is not clear whether similar thermal problems occur. These systems have very different characteristics from the high performance ones: they consume hundred times less power, they are based on a multi-processor architecture with lots of embedded memory and rely on cheap packaging solutions. In this paper, we investigate the need for temperature-aware design in a low-power systems-on-a-chip and provide guidlines to delimit the conditions for which temperature-aware design is needed.

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Cited By

Kumar SZjajo Avan Leuken R(2017)Fighting Dark SiliconIEEE Transactions on Very Large Scale Integration (VLSI) Systems10.1109/TVLSI.2016.264258725:4(1549-1562)Online publication date: 1-Apr-2017
https://dl.acm.org/doi/10.1109/TVLSI.2016.2642587
Rai DThiele LNebel WAtienza D(2015)A calibration based thermal modeling technique for complex multicore systemsProceedings of the 2015 Design, Automation & Test in Europe Conference & Exhibition10.5555/2755753.2757076(1138-1143)Online publication date: 9-Mar-2015
https://dl.acm.org/doi/10.5555/2755753.2757076
Cui JMaskell DLin Y(2010)High level event driven thermal estimation for thermal aware task allocation and schedulingProceedings of the 2010 Asia and South Pacific Design Automation Conference10.5555/1899721.1899903(793-798)Online publication date: 18-Jan-2010
https://dl.acm.org/doi/10.5555/1899721.1899903
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Published In

cover image Guide Proceedings

DATE '06: Proceedings of the conference on Design, automation and test in Europe: Proceedings

March 2006

1390 pages

ISBN:3981080106

General Chair:
Georges Gielen
KU Leuven, BE

Sponsors

EDAA: European Design Automation Association
The EDA Consortium
IEEE-CS\DATC: The IEEE Computer Society

Publisher

European Design and Automation Association

Leuven, Belgium

Publication History

Published: 06 March 2006

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DATE '06 Paper Acceptance Rate 267 of 834 submissions, 32%;

Overall Acceptance Rate 518 of 1,794 submissions, 29%

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Cited By

Kumar SZjajo Avan Leuken R(2017)Fighting Dark SiliconIEEE Transactions on Very Large Scale Integration (VLSI) Systems10.1109/TVLSI.2016.264258725:4(1549-1562)Online publication date: 1-Apr-2017
https://dl.acm.org/doi/10.1109/TVLSI.2016.2642587
Rai DThiele LNebel WAtienza D(2015)A calibration based thermal modeling technique for complex multicore systemsProceedings of the 2015 Design, Automation & Test in Europe Conference & Exhibition10.5555/2755753.2757076(1138-1143)Online publication date: 9-Mar-2015
https://dl.acm.org/doi/10.5555/2755753.2757076
Cui JMaskell DLin Y(2010)High level event driven thermal estimation for thermal aware task allocation and schedulingProceedings of the 2010 Asia and South Pacific Design Automation Conference10.5555/1899721.1899903(793-798)Online publication date: 18-Jan-2010
https://dl.acm.org/doi/10.5555/1899721.1899903
Bartolini ACacciari MTilli ABenini LGries MBahar RLombardi FAtienza DBrunvand E(2010)A virtual platform environment for exploring power, thermal and reliability management control strategies in high-performance multicoresProceedings of the 20th symposium on Great lakes symposium on VLSI10.1145/1785481.1785553(311-316)Online publication date: 16-May-2010
https://dl.acm.org/doi/10.1145/1785481.1785553
Acquaviva ACalimera AMacii APoncino MMacii EGiaconia MParrella CBahar RLombardi FAtienza DBrunvand E(2010)An integrated thermal estimation framework for industrial embedded platformsProceedings of the 20th symposium on Great lakes symposium on VLSI10.1145/1785481.1785550(293-298)Online publication date: 16-May-2010
https://dl.acm.org/doi/10.1145/1785481.1785550
Zanini FAtienza DDe Micheli GBoyd SBahar RLombardi FAtienza DBrunvand E(2010)Online convex optimization-based algorithm for thermal management of MPSoCsProceedings of the 20th symposium on Great lakes symposium on VLSI10.1145/1785481.1785532(203-208)Online publication date: 16-May-2010
https://dl.acm.org/doi/10.1145/1785481.1785532
Zanini FAtienza DDe Micheli GWakabayashi K(2009)A control theory approach for thermal balancing of MPSoCProceedings of the 2009 Asia and South Pacific Design Automation Conference10.5555/1509633.1509645(37-42)Online publication date: 19-Jan-2009
https://dl.acm.org/doi/10.5555/1509633.1509645
Sander BSchnerr JBringmann ORosenstiel WWakabayashi K(2009)ESL power analysis of embedded processors for temperature and reliability estimationsProceedings of the 7th IEEE/ACM international conference on Hardware/software codesign and system synthesis10.1145/1629435.1629469(239-248)Online publication date: 11-Oct-2009
https://dl.acm.org/doi/10.1145/1629435.1629469
Cui JMaskell DLombardi FBhanja SMassoud YBahar R(2009)Dynamic thermal-aware scheduling on chip multiprocessor for soft real-time systemProceedings of the 19th ACM Great Lakes symposium on VLSI10.1145/1531542.1531631(393-396)Online publication date: 10-May-2009
https://dl.acm.org/doi/10.1145/1531542.1531631
Mulas FAtienza DAcquaviva ACarta SBenini LDe Micheli G(2009)Thermal balancing policy for multiprocessor stream computing platformsIEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems10.1109/TCAD.2009.203237228:12(1870-1882)Online publication date: 1-Dec-2009
https://dl.acm.org/doi/10.1109/TCAD.2009.2032372
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