| An integrated open framework for heterogeneous MPSoC design space exploration |
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Design, Automation, and Test in Europe
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Proceedings of the conference on Design, automation and test in Europe: Proceedings
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Munich, Germany
SESSION: Semi-formal validation methods
table of contents
Pages: 1145 - 1150
Year of Publication: 2006
ISBN:3-9810801-0-6
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Authors
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Federico Angiolini
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University of Bologna, Bologna, Italy
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Jianjiang Ceng
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RWTH Aachen University, Aachen, Germany
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Rainer Leupers
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RWTH Aachen University, Aachen, Germany
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Federico Ferrari
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University of Bologna, Bologna, Italy
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Cesare Ferri
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University of Bologna, Bologna, Italy
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Luca Benini
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University of Bologna, Bologna, Italy
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European Design and Automation Association
3001 Leuven, Belgium, Belgium
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Downloads (6 Weeks): 4, Downloads (12 Months): 103, Citation Count: 3
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ABSTRACT
In recent years, increasing manufacturing density has allowed the development of Multi-Processor Systems-on-Chip (MPSoCs). Application-Specific Instruction Set Processors (ASIPs) stand out as one of the most efficient design paradigms and could be especially effective as SoC computing engines. However, multiple hurdles which are hindering the productivity of SoC designers and researchers must be solved first. Among them, the difficulty of thoroughly exploring the design space by simultaneously sweeping axes like processing elements, memory hierarchies and chip interconnect fabrics. We tackle this challenge by proposing an integrated approach where state-of-the-art platform modeling infrastructures, at the IP core level and at the system level, meet to provide the designer with maximum openness and flexibility in terms of design space exploration.1
REFERENCES
Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.
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CITED BY 3
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Cesare Ferri , Amber Viescas , Tali Moreshet , R. Iris Bahar , Maurice Herlihy, Energy efficient synchronization techniques for embedded architectures, Proceedings of the 18th ACM Great Lakes symposium on VLSI, May 04-06, 2008, Orlando, Florida, USA
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