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A fast HW/SW FPGA-based thermal emulation framework for multi-processor system-on-chip

Published: 24 July 2006 Publication History

Abstract

With the growing complexity in consumer embedded products and the improvements in process technology, Multi-Processor System-On-Chip (MPSoC) architectures have become widespread. These new systems are complex to design as they must execute multiple complex applications (e.g. video processing, 3D games), while meeting additional design constraints (e.g. energy consumption or time-to-market). Moreover, the rise of temperature in the die for MPSoC components can seriously affect their final performance and reliability. Therefore, mechanisms to efficiently evaluate complete HW/SW MPSoC designs in terms of energy consumption, temperature, performance and other key metrics are needed. In this paper, we present a new HW/SW FPGA-based emulation framework that allows designers to rapidly extract a number of critical statistics from processing cores, memories and interconnection systems being emulated on a FPGA. This information is then used to interact in real-time with a SW thermal model running on a host computer via an Ethernet port. The results show speed-ups of three orders of magnitude compared to cycle-accurate MPSoC simulators, which enable a very fast exploration of a large range of MPSoC design alternatives at the cycle-accurate level. Finally, our HW/SW framework allows designers to test run-time thermal management strategies with real-life inputs without any loss in the performance of the emulated system.

References

[1]
A. Jerraya, et al. Multiprocessor SoCs. Morgan Kaufmann, 2005.
[2]
Kevin Skadron, et al. Temperature-aware microarchitecture: Modeling and implementation. TACO, pp. 94--125, 2004.
[3]
L. Benini, et al. Mparm: Exploring the MPSoC design space with SystemC. Journal of VLSI, pp. 169--182, 2005.
[4]
G. Braun, et al. Processor/memory co-exploration on multiple abstraction levels. In Proc. of DATE, 2003.
[5]
Cadence Palladium II, 2005. http://www.cadence.com.
[6]
ARM integrator AP, 2004. http://www.arm.com.
[7]
Emulation and Verification Engineering. Zebu Xl and ZV models, 2005. http://www.eve-team.com.
[8]
ARM. PrimeXSys platform architecture and methodologies, white paper. Technical report, 2004.
[9]
M. Graphics. Platform express and primecell, 2003. http://www.mentor.com/.
[10]
Synopsys. Realview Maxsim ESL environment, 2003. http://www.synopsys.com/.
[11]
M. Diaz Nava, et al. An open platform for developing MPSoCs. IEEE Computer, pp. 60--67, 2005.
[12]
Y. Nakamura, et al. A fast HW/SW co-verification method for SoC by using a c/c++ simulator and FPGA emulator with shared register communication. Proc. DAC, 2004.
[13]
H. Su, et al. Full chip leakage estimation considering power supply and temperature variations. Proc. ISLPED, 2003.
[14]
J. Srinivasan, et al. Predictive Dynamic Thermal Management for Multimedia Applications. Proc. HPCA, 2001.
[15]
M. Huang, et al. A framework for dynamic energy efficiency and temperature management. Proc. MICRO, 2003.
[16]
A. Jalabert, et al. xpipescompiler: A tool for instantiating application specific NoCs. Proc. DATE, 2004.
[17]
R. W. Floyd, et al. Adaptive algorithm for spatial gray scale. Proc. ISDT, 1985.

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  • (2022)An FPGA-based Approach to Evaluate Thermal and Resource Management Strategies of Many-core ProcessorsACM Transactions on Architecture and Code Optimization10.1145/351682519:3(1-24)Online publication date: 4-May-2022
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  1. A fast HW/SW FPGA-based thermal emulation framework for multi-processor system-on-chip

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        cover image ACM Conferences
        DAC '06: Proceedings of the 43rd annual Design Automation Conference
        July 2006
        1166 pages
        ISBN:1595933816
        DOI:10.1145/1146909
        Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than ACM must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from [email protected]

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        Publication History

        Published: 24 July 2006

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        Author Tags

        1. FPGA
        2. MPSoC
        3. emulation
        4. thermal studies

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        July 24 - 28, 2006
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        Overall Acceptance Rate 1,770 of 5,499 submissions, 32%

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        Cited By

        View all
        • (2024)ControlPULP: A RISC-V On-Chip Parallel Power Controller for Many-Core HPC Processors with FPGA-Based Hardware-In-The-Loop Power and Thermal EmulationInternational Journal of Parallel Programming10.1007/s10766-024-00761-452:1-2(93-123)Online publication date: 1-Apr-2024
        • (2022)Neural Topic Model Training with the REBAR Gradient EstimatorACM Transactions on Asian and Low-Resource Language Information Processing10.1145/351733621:5(1-18)Online publication date: 15-Nov-2022
        • (2022)An FPGA-based Approach to Evaluate Thermal and Resource Management Strategies of Many-core ProcessorsACM Transactions on Architecture and Code Optimization10.1145/351682519:3(1-24)Online publication date: 4-May-2022
        • (2022)Towards Revenue Maximization with Popular and Profitable ProductsACM/IMS Transactions on Data Science10.1145/34880582:4(1-21)Online publication date: 24-May-2022
        • (2017)McFTP: A Framework to Explore and Prototype Multi-core Thermal Managements on Real Processors2017 IEEE Trustcom/BigDataSE/ICESS10.1109/Trustcom/BigDataSE/ICESS.2017.316(806-814)Online publication date: Aug-2017
        • (2017)An FPGA-based thermal emulation framework for multicore systems2017 27th International Symposium on Power and Timing Modeling, Optimization and Simulation (PATMOS)10.1109/PATMOS.2017.8106964(1-6)Online publication date: Sep-2017
        • (2016)StroberACM SIGARCH Computer Architecture News10.1145/3007787.300115144:3(128-139)Online publication date: 18-Jun-2016
        • (2016)StroberProceedings of the 43rd International Symposium on Computer Architecture10.1109/ISCA.2016.21(128-139)Online publication date: 18-Jun-2016
        • (2015)COSSIM : A Novel, Comprehensible, Ultra-Fast, Security-Aware CPS SimulatorApplied Reconfigurable Computing10.1007/978-3-319-16214-0_50(542-553)Online publication date: 31-Mar-2015
        • (2014)Temperature modeling and emulation of an ASIC temperature monitor system for Tightly-Coupled Processor Arrays (TCPAs)Advances in Radio Science10.5194/ars-12-103-201412(103-109)Online publication date: 10-Nov-2014
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