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Are carbon nanotubes the future of VLSI interconnections?

Published: 24 July 2006 Publication History

Abstract

Increasing resistivity of copper with scaling and rising demands on current density requirements are driving the need to identify new wiring solutions for deep nanometer scale VLSI technologies. Metallic carbon nanotubes (CNTs) are promising candidates that can potentially address the challenges faced by copper and thereby extend the lifetime of electrical interconnects. This paper examines the state-of-the-art in CNT interconnect research and discusses both the advantages and challenges of this emerging nanotechnology.

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  • (2023)Structure optimization: Configuring optimum performance of randomly distributed mixed carbon nanotube bundle interconnectsInternational Journal of Circuit Theory and Applications10.1002/cta.360551:8(3949-3967)Online publication date: 28-Mar-2023
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      cover image ACM Conferences
      DAC '06: Proceedings of the 43rd annual Design Automation Conference
      July 2006
      1166 pages
      ISBN:1595933816
      DOI:10.1145/1146909
      Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than ACM must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from [email protected]

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      Published: 24 July 2006

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      Author Tags

      1. VLSI
      2. carbon nanotubes
      3. interconnects

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      July 24 - 28, 2006
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      • (2023)Modified Knowledge-Based Neural Networks Using Control Variates for the Fast Uncertainty Quantification of On-Chip MWCNT InterconnectsIEEE Transactions on Electromagnetic Compatibility10.1109/TEMC.2023.327969565:4(1232-1246)Online publication date: Aug-2023
      • (2023)Structure optimization: Configuring optimum performance of randomly distributed mixed carbon nanotube bundle interconnectsInternational Journal of Circuit Theory and Applications10.1002/cta.360551:8(3949-3967)Online publication date: 28-Mar-2023
      • (2022)A Theoretical Modeling of Adaptive Mixed CNT Bundles for High-Speed VLSI Interconnect DesignCrystals10.3390/cryst1202018612:2(186)Online publication date: 27-Jan-2022
      • (2022)A Cost-Effective Built-In Self-Test Mechanism for Post-Manufacturing TSV Defects in 3D ICsACM Journal on Emerging Technologies in Computing Systems10.1145/351780818:4(1-23)Online publication date: 13-Oct-2022
      • (2022)Exploring the Impact of Parametric Variability on Eye Diagram of On-Chip Multi-walled Carbon Nanotube Interconnects using Fast Machine Learning Techniques2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)10.1109/ECTC51906.2022.00160(981-986)Online publication date: May-2022
      • (2022)A Bilevel Multi-Fidelity Polynomial Chaos Approach for the Uncertainty Quantification of MWCNT Interconnect Networks With Variable Imperfect Contact ResistancesIEEE Access10.1109/ACCESS.2022.321422010(109925-109936)Online publication date: 2022
      • (2022)Analysis and Simulation of Various Parameters of Mixed CNT Bundle for Interconnect ApplicationsSustainable Technology and Advanced Computing in Electrical Engineering10.1007/978-981-19-4364-5_78(1099-1115)Online publication date: 3-Nov-2022
      • (2021)Structure Fortification of Mixed CNT Bundle Interconnects for Nano Integrated Circuits Using Constraint-Based Particle Swarm OptimizationIEEE Transactions on Nanotechnology10.1109/TNANO.2021.305876020(194-204)Online publication date: 2021
      • (2021)Two-Level Multifidelity Algorithm With Dimension Reduction for Efficient Uncertainty Quantification of MWCNT InterconnectsIEEE Transactions on Electromagnetic Compatibility10.1109/TEMC.2021.306735863:6(1941-1950)Online publication date: Dec-2021
      • (2021)Dielectric Surface Roughness Scattering Induced Crosstalk Performance of Coupled MCB InterconnectsMicroelectronics Journal10.1016/j.mejo.2021.105084(105084)Online publication date: May-2021
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