This paper reports on glass frit wafer bonding, which is a universally usable technology for wafer level encapsulation and packaging. After explaining the principle and the process flow of glass frit bonding, experimental results are shown. Glass frit ...
Suitable mold materials are critical for successful high volume replication of micro optical components. As one of the emerging new materials, bulk metallic glass (BMG) can serve as high-quality mold material to overcome the existing changelings with ...
Micro molding of polymers is one of the main methods for large mass non-electronic micro devices, in which the micro mold fabrication is very critical. Metallic glass can be thermoplastic forming without any internal stress and shrinkage defects when it ...
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