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Active bank switching for temperature control of the register file in a microprocessor

Published: 11 March 2007 Publication History

Abstract

An effective thermal management scheme, called active bank switching, for temperature control in the register file of a microprocessor is presented. The idea is to divide the physical register file into two equal-sized banks, and to alternate between the two banks when allocating new registers to the instruction operands. Experimental results show that this periodic active bank switching scheme achieves 3.4°C of steady-state temperature reduction, with a mere 0.75% average performance penalty.

References

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K. Skadron, "Hybrid Architectural Dynamic Thermal Management," Proc. of the Design Automation and Test in Europe, 2004.
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    cover image ACM Conferences
    GLSVLSI '07: Proceedings of the 17th ACM Great Lakes symposium on VLSI
    March 2007
    626 pages
    ISBN:9781595936059
    DOI:10.1145/1228784
    Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than ACM must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from [email protected]

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    Published: 11 March 2007

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    Author Tags

    1. register file
    2. temperature-aware design
    3. thermal model

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    March 11 - 13, 2007
    Stresa-Lago Maggiore, Italy

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    Overall Acceptance Rate 312 of 1,156 submissions, 27%

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