skip to main content
10.1145/1231996.1232001acmconferencesArticle/Chapter ViewAbstractPublication PagesispdConference Proceedingsconference-collections
Article

Dummy fill density analysis with coupling constraints

Published: 18 March 2007 Publication History

Abstract

In modern VLSI manufacturing processes, dummy fills are widely used to adjust local metal density in order to improve layout uniformity and yield optimization. However, the introduction of a large amount of dummy features also affects wire electrical properties. In this paper, we propose the first Coupling constrained Dummy Fill (CDF) analysis algorithm which identifies feasible locations for dummy fills such that the fill induced coupling capacitance can be bounded within the given coupling threshold of each wire segment. The algorithm also makes efforts to maximize ground dummy fills, which are more robust and predictable. The output of the algorithm can be treated as the upper bound for dummy fill insertion, and it can be easily adopted in density models to guide dummy fill insertion without disturbing the existing design.

References

[1]
Y. Chen, A. B. Kahng, G. Robins and A. Zelikovsky, Practical Iterated Fill Synthesis for CMP Uniformity, Proc. of Design Automation Conf., pp. 671--674, June 2000.
[2]
Y. Chen, A. B. Kahng, G. Robins and A. Zelikovsky, Hierarchical Dummy Fill for Process Uniformity, Proc. Asia and South Pacific Design Automation Conf., pp. 139--144, Jan. 2001.
[3]
Y. Chen, A. B. Kahng, G. Robins and A. Zelikovsky, Closing the Smoothness and Uniformity Gap in Area Fill Synthesis, Proc. ACM/IEEE Intl. Symp. on Physical Design, pp. 137--142, April 2002.
[4]
Y. Chen, A. B. Kahng, G. Robins, A. Zelikovsky, and Y. H. Zheng, Data Volume Reduction in Dummy Fill Generation, Proc. Design Automation and Testing in Europe, pp. 868--873, March 2003.
[5]
Y. Chen, P. Gupta, and A. B. Kahng, Performance-Impact Limited Area Fill Synthesis, Proc. of Design Automation Conf., pp. 22--27, June 2003.
[6]
L. He, A. B. Kahng, K. H. Tam and J. Xiong, Design of Integrated-Circuit Interconnects with Accurate Modeling of Chemical-Mechanical Planarization, Proc. of SPIE Vol. 5756, Bellingham, WA, 2005.
[7]
K. S. Leung, SPIDER: Simultaneous Post-Layout IR-Drop and Metal Density Enhancement with Redundant Fill, Proc. of ICCAD, pp. 33--38, San Jose, CA, 2005.
[8]
R. Tian, X. Tang, and D. F. Wong, Dummy Feature Placement for Chemical-Mechanical Polishing Uniformity in a Shallow Trench Isolation Process, Proc. International Symposium on Physical Design, pp 118--123, 2001.
[9]
R. Tian, D. F. Wong, and R. Boone, Model-based Dummy Feature Placement for Oxide Chemical-Mechanical Polishing Manufacturability, Proc. Design Automation Conf, pp 667--670, 2000.
[10]
T. Sakurai and k. Tamaru. Simple Formulas for Two and Three Dimensional Capacitance, IEEE Trans. Electron Devices, 1983.
[11]
B. E. Stine, D. S. Boning, J. E. Chung, L. Camilletti, F. Kruppa, E. R. Equi, W. Loh, S. Prasad, M. Muthukrishnan, D. Towery, M. Berman, and A. Kapoor, The physical and electrical effects of metal-fill patterning practices for oxide chemical-mechanical polishing processes. IEEE Trans. on Electron Devices, 45(3), pp. 665--679, 1998.
[12]
H. Zhou and M. D. F. Wong, Global Routing with Crosstalk Constraints, ACM/IEEE DAC, San Francisco, CA, 1998.

Cited By

View all
  • (2024)pNeurFill: Enhanced Neural Network Model-Based Dummy Filling Synthesis With Perimeter AdjustmentIEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems10.1109/TCAD.2023.332062943:2(667-680)Online publication date: Feb-2024
  • (2022)Timing-Aware Fill Insertions With Design-Rule and Density ConstraintsIEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems10.1109/TCAD.2021.313385441:10(3529-3542)Online publication date: Oct-2022
  • (2016)Simultaneous EUV Flare Variation Minimization and CMP Control by Coupling-Aware DummificationIEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems10.1109/TCAD.2015.248849235:4(598-610)Online publication date: Apr-2016
  • Show More Cited By

Recommendations

Comments

Information & Contributors

Information

Published In

cover image ACM Conferences
ISPD '07: Proceedings of the 2007 international symposium on Physical design
March 2007
206 pages
ISBN:9781595936134
DOI:10.1145/1231996
Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than ACM must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from [email protected]

Sponsors

Publisher

Association for Computing Machinery

New York, NY, United States

Publication History

Published: 18 March 2007

Permissions

Request permissions for this article.

Check for updates

Author Tags

  1. CMP
  2. coupling
  3. dummy fills

Qualifiers

  • Article

Conference

ISPD07
Sponsor:
ISPD07: International Symposium on Physical Design
March 18 - 21, 2007
Texas, Austin, USA

Acceptance Rates

Overall Acceptance Rate 62 of 172 submissions, 36%

Upcoming Conference

ISPD '25
International Symposium on Physical Design
March 16 - 19, 2025
Austin , TX , USA

Contributors

Other Metrics

Bibliometrics & Citations

Bibliometrics

Article Metrics

  • Downloads (Last 12 months)9
  • Downloads (Last 6 weeks)0
Reflects downloads up to 09 Feb 2025

Other Metrics

Citations

Cited By

View all
  • (2024)pNeurFill: Enhanced Neural Network Model-Based Dummy Filling Synthesis With Perimeter AdjustmentIEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems10.1109/TCAD.2023.332062943:2(667-680)Online publication date: Feb-2024
  • (2022)Timing-Aware Fill Insertions With Design-Rule and Density ConstraintsIEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems10.1109/TCAD.2021.313385441:10(3529-3542)Online publication date: Oct-2022
  • (2016)Simultaneous EUV Flare Variation Minimization and CMP Control by Coupling-Aware DummificationIEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems10.1109/TCAD.2015.248849235:4(598-610)Online publication date: Apr-2016
  • (2015)EUV and e-beam manufacturabilityProceedings of the 52nd Annual Design Automation Conference10.1145/2744769.2747925(1-6)Online publication date: 7-Jun-2015
  • (2015)High performance dummy fill insertion with coupling and uniformity constraintsProceedings of the 52nd Annual Design Automation Conference10.1145/2744769.2744850(1-6)Online publication date: 7-Jun-2015
  • (2015)Flare reduction in EUV Lithography by perturbation of wire segments2015 IFIP/IEEE International Conference on Very Large Scale Integration (VLSI-SoC)10.1109/VLSI-SoC.2015.7314383(7-12)Online publication date: Oct-2015
  • (2014)ICCAD-2014 CAD contest in design for manufacturability flow for advanced semiconductor nodes and benchmark suiteProceedings of the 2014 IEEE/ACM International Conference on Computer-Aided Design10.5555/2691365.2691439(367-368)Online publication date: 3-Nov-2014
  • (2014)Simultaneous EUV Flare Variation Minimization and CMP Control with Coupling-Aware DummificationProceedings of the 51st Annual Design Automation Conference10.1145/2593069.2593215(1-6)Online publication date: 1-Jun-2014
  • (2014)ICCAD-2014 CAD contest in design for manufacturability flow for advanced semiconductor nodes and benchmark suite2014 IEEE/ACM International Conference on Computer-Aided Design (ICCAD)10.1109/ICCAD.2014.7001377(367-368)Online publication date: Nov-2014
  • (2014)Simultaneous EUV flare variation minimization and CMP control with coupling-aware dummification2014 51st ACM/EDAC/IEEE Design Automation Conference (DAC)10.1109/DAC.2014.6881381(1-6)Online publication date: Jun-2014
  • Show More Cited By

View Options

Login options

View options

PDF

View or Download as a PDF file.

PDF

eReader

View online with eReader.

eReader

Figures

Tables

Media

Share

Share

Share this Publication link

Share on social media