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Design and CAD challenges in 45nm CMOS and beyond

Published: 05 November 2006 Publication History

Abstract

With semiconductor industry's aggressive march towards 45nm CMOS technology and introduction of new materials and device structures in sight for 32nm and 22nm nodes, it is crucial for the IC design and CAD community to understand the challenges posed by these potential technology changes. This tutorial will focus on these challenges starting from front end of line (devices) to the back end of line (interconnects) and finally the impact on CAD. We will discuss the impact of various device technology options/improvements, such as high-k, metal gate, low temperature operation, increased mobility and reduced variability, on the overall chip performance in the context of power-constrained technology optimization. This will show that power constraints limit, but do not eliminate, the performance improvements available from new technology. The integration issues related to low-k materials for interconnects in 45nm and beyond will be examined in the context of advanced IC design. Ultra low-k materials, evolution of etch and chemical mechanical polishing (CMP), and techniques to limit damage during processing and their impact on design performance will be discussed in detail. These advanced device and interconnect structures and materials including 3D technology have tremendous impact on the direction of the CAD industry. We will discuss the design methodology and CAD implications of these imminent technology changes.

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cover image ACM Conferences
ICCAD '06: Proceedings of the 2006 IEEE/ACM international conference on Computer-aided design
November 2006
147 pages
ISBN:1595933891
DOI:10.1145/1233501
Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than ACM must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from [email protected]

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Published: 05 November 2006

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