Article

Thermal characterization and optimization in platform FPGAs

Authors:

Priya Sundararajan,

N. Vijaykrishnan,

T. TuanAuthors Info & Claims

ICCAD '06: Proceedings of the 2006 IEEE/ACM international conference on Computer-aided design

Pages 443 - 447

https://doi.org/10.1145/1233501.1233589

Published: 05 November 2006 Publication History

Abstract

Increasing power densities in Field Programmable Gate Arrays (FPGAs) have made them susceptible to thermal problems. The advent of platform FPGAs has further exacerbated the problems by increasing the power density variations on the FPGA fabric. Therefore, we need to characterize the die temperature of platform FPGAs. In this paper, we first estimate the temperature distribution within a Virtex-4 FPGA by feeding the block power numbers in an architecture-level temperature simulator calibrated to reflect a real FPGA package. We analyze the impact of different hard-wired blocks on the temperature profile, and observe that they introduce intra-die variation in temperature of up to 20°C. Next, we evaluate the influence of placement on temperature. Our experiments indicate a decrease in peak temperature by changing the placement of hard blocks, especially the high-speed transceivers. We further propose an iterative placement technique to reduce the peak temperature, and apply it on real designs. Finally, we propose alternate organizations of the hard blocks in the FPGA fabric to reduce temperature.

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Cited By

Siozios KSoudris DHübner M(2014)A Framework for Supporting Adaptive Fault-Tolerant SolutionsACM Transactions on Embedded Computing Systems10.1145/262947313:5s(1-22)Online publication date: 15-Dec-2014
https://dl.acm.org/doi/10.1145/2629473
Weber PZagrabski MWojciechowski BNikodem MKepa KBerezowski K(2014)Calibration of RO-based temperature sensors for a toolset for measuring thermal behavior of FPGA devicesMicroelectronics Journal10.1016/j.mejo.2014.06.00445:12(1753-1763)Online publication date: 1-Dec-2014
https://dl.acm.org/doi/10.1016/j.mejo.2014.06.004
Huang JHuang YHsu MChang HCompton KHutchings B(2012)Thermal-aware logic block placement for 3D FPGAs considering lateral heat dissipation (abstract only)Proceedings of the ACM/SIGDA international symposium on Field Programmable Gate Arrays10.1145/2145694.2145749(268-268)Online publication date: 22-Feb-2012
https://dl.acm.org/doi/10.1145/2145694.2145749
Show More Cited By

Index Terms

Thermal characterization and optimization in platform FPGAs
1. Hardware
  1. Electronic design automation
    1. Physical design (EDA)
      1. Placement
      2. Wire routing
  2. Robustness

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cover image ACM Conferences

ICCAD '06: Proceedings of the 2006 IEEE/ACM international conference on Computer-aided design

November 2006

147 pages

ISBN:1595933891

DOI:10.1145/1233501

General Chair:
Soha Hassoun
Tufts Univ., Medford, MA

Copyright © 2006 ACM.

Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than ACM must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from [email protected]

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SIGDA: ACM Special Interest Group on Design Automation
IEEE-CAS: Circuits & Systems
IEEE-CS: Computer Society

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Association for Computing Machinery

New York, NY, United States

Publication History

Published: 05 November 2006

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ICCAD06: The International Conference on Computer-Aided Design 2006

November 5 - 9, 2006

California, San Jose

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Overall Acceptance Rate 457 of 1,762 submissions, 26%

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Cited By

Siozios KSoudris DHübner M(2014)A Framework for Supporting Adaptive Fault-Tolerant SolutionsACM Transactions on Embedded Computing Systems10.1145/262947313:5s(1-22)Online publication date: 15-Dec-2014
https://dl.acm.org/doi/10.1145/2629473
Weber PZagrabski MWojciechowski BNikodem MKepa KBerezowski K(2014)Calibration of RO-based temperature sensors for a toolset for measuring thermal behavior of FPGA devicesMicroelectronics Journal10.1016/j.mejo.2014.06.00445:12(1753-1763)Online publication date: 1-Dec-2014
https://dl.acm.org/doi/10.1016/j.mejo.2014.06.004
Huang JHuang YHsu MChang HCompton KHutchings B(2012)Thermal-aware logic block placement for 3D FPGAs considering lateral heat dissipation (abstract only)Proceedings of the ACM/SIGDA international symposium on Field Programmable Gate Arrays10.1145/2145694.2145749(268-268)Online publication date: 22-Feb-2012
https://dl.acm.org/doi/10.1145/2145694.2145749
Zick KHayes JCheung PWawrzynek J(2010)On-line sensing for healthier FPGA systemsProceedings of the 18th annual ACM/SIGDA international symposium on Field programmable gate arrays10.1145/1723112.1723153(239-248)Online publication date: 21-Feb-2010
https://dl.acm.org/doi/10.1145/1723112.1723153
Gulati KKhatri SLi PChow PCheung P(2009)Closed-loop modeling of power and temperature profiles of FPGAsProceedings of the ACM/SIGDA international symposium on Field programmable gate arrays10.1145/1508128.1508207(287-287)Online publication date: 24-Feb-2009
https://dl.acm.org/doi/10.1145/1508128.1508207
Mangalagiri PBae SKrishnan RXie YNarayanan VNassif SRoychowdhury J(2008)Thermal-aware reliability analysis for platform FPGAsProceedings of the 2008 IEEE/ACM International Conference on Computer-Aided Design10.5555/1509456.1509613(722-727)Online publication date: 10-Nov-2008
https://dl.acm.org/doi/10.5555/1509456.1509613
Gayasen ANarayanan VKandemir MRahman A(2008)Designing a 3-D FPGAIEEE Transactions on Very Large Scale Integration (VLSI) Systems10.1109/TVLSI.2008.200045616:7(882-893)Online publication date: 1-Jul-2008
https://dl.acm.org/doi/10.1109/TVLSI.2008.2000456

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