Article

CMOS-MEMS integration: why, how and what?

Author:

Ann WitvrouwAuthors Info & Claims

ICCAD '06: Proceedings of the 2006 IEEE/ACM international conference on Computer-aided design

Pages 826 - 827

https://doi.org/10.1145/1233501.1233672

Published: 05 November 2006 Publication History

Abstract

CMOS-MEMS integration can improve the performance of the MEMS (micro-electromechanical systems), allows for smaller packages and leads to a lower packaging and instrumentation cost. As argued in this article, processing MEMS above CMOS is the most promising approach for CMOS-MEMS integration, but it limits the thermal budget for MEMS processing. Poly-SiGe provides the desired material properties for MEMS applications at significantly lower temperatures compared to Poly-Si. A case study of a CMOS-integrated SiGe gyroscope will be presented.

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Cited By

He YYu ALiu XWang Y(2023)Micro Electro-Mechanical Systems (MEMS)Handbook of Integrated Circuit Industry10.1007/978-981-99-2836-1_48(895-911)Online publication date: 28-Nov-2023
https://doi.org/10.1007/978-981-99-2836-1_48
Goritz AWipf SDrost MLisker MWipf CWietstruck MKaynak M(2022)Monolithic Integration of a Wafer-Level Thin-Film Encapsulated mm-Wave RF-MEMS Switch in BEOL of a 130-nm SiGe BiCMOS TechnologyIEEE Transactions on Components, Packaging and Manufacturing Technology10.1109/TCPMT.2022.317250212:6(921-932)Online publication date: Jun-2022
https://doi.org/10.1109/TCPMT.2022.3172502
Pinto RGund VDias RNagaraja KVinayakumar K(2022)CMOS-Integrated Aluminum Nitride MEMS: A ReviewJournal of Microelectromechanical Systems10.1109/JMEMS.2022.317276631:4(500-523)Online publication date: Aug-2022
https://doi.org/10.1109/JMEMS.2022.3172766
Show More Cited By

Index Terms

CMOS-MEMS integration: why, how and what?
1. Hardware
  1. Robustness

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cover image ACM Conferences

ICCAD '06: Proceedings of the 2006 IEEE/ACM international conference on Computer-aided design

November 2006

147 pages

ISBN:1595933891

DOI:10.1145/1233501

General Chair:
Soha Hassoun
Tufts Univ., Medford, MA

Copyright © 2006 ACM.

Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than ACM must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from [email protected]

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New York, NY, United States

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Published: 05 November 2006

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ICCAD06: The International Conference on Computer-Aided Design 2006

November 5 - 9, 2006

California, San Jose

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Cited By

He YYu ALiu XWang Y(2023)Micro Electro-Mechanical Systems (MEMS)Handbook of Integrated Circuit Industry10.1007/978-981-99-2836-1_48(895-911)Online publication date: 28-Nov-2023
https://doi.org/10.1007/978-981-99-2836-1_48
Goritz AWipf SDrost MLisker MWipf CWietstruck MKaynak M(2022)Monolithic Integration of a Wafer-Level Thin-Film Encapsulated mm-Wave RF-MEMS Switch in BEOL of a 130-nm SiGe BiCMOS TechnologyIEEE Transactions on Components, Packaging and Manufacturing Technology10.1109/TCPMT.2022.317250212:6(921-932)Online publication date: Jun-2022
https://doi.org/10.1109/TCPMT.2022.3172502
Pinto RGund VDias RNagaraja KVinayakumar K(2022)CMOS-Integrated Aluminum Nitride MEMS: A ReviewJournal of Microelectromechanical Systems10.1109/JMEMS.2022.317276631:4(500-523)Online publication date: Aug-2022
https://doi.org/10.1109/JMEMS.2022.3172766
Ahmadi AKabiri SOmidfar K(2020)Advances in HbA1c Biosensor Development Based on Field Effect Transistors: A ReviewIEEE Sensors Journal10.1109/JSEN.2020.2987836(1-1)Online publication date: 2020
https://doi.org/10.1109/JSEN.2020.2987836
Lu JKuwabara HKurashima YZhang LTakagi H(2019)Optimization and evaluation of the size-free integration process for MEMS-IC assembly with high yields and high efficiencyMicroelectronic Engineering10.1016/j.mee.2015.03.038145:C(75-81)Online publication date: 1-Jan-2019
https://dl.acm.org/doi/10.1016/j.mee.2015.03.038
Mori KGiang Dao Tran ZRamon MWoo JPeng Lu (2017)Innovative and 3D stacking Micro Electro Mechanical Systems (I-MEMS) for power saving2017 IEEE International Conference on IC Design and Technology (ICICDT)10.1109/ICICDT.2017.7993518(1-3)Online publication date: May-2017
https://doi.org/10.1109/ICICDT.2017.7993518
Alvarez CArriaga WAranda MJacome A(2017)Anisotropic silicon etch to house CMOS compatible MEMS microstructures without planarization techniques2017 14th International Conference on Electrical Engineering, Computing Science and Automatic Control (CCE)10.1109/ICEEE.2017.8108843(1-4)Online publication date: Oct-2017
https://doi.org/10.1109/ICEEE.2017.8108843
Bourgeois JGoldstein S(2015)Distributed Intelligent MEMS: Progresses and PerspectivesIEEE Systems Journal10.1109/JSYST.2013.22811249:3(1057-1068)Online publication date: Sep-2015
https://doi.org/10.1109/JSYST.2013.2281124
Bourgeois JGoldstein S(2012)Distributed Intelligent MEMS: Progresses and PerspectivesICT Innovations 201110.1007/978-3-642-28664-3_2(15-25)Online publication date: 2012
https://doi.org/10.1007/978-3-642-28664-3_2
Amponsah KLal A(2011)Monolithically integrated junction FETS and NEMS2011 IEEE 24th International Conference on Micro Electro Mechanical Systems10.1109/MEMSYS.2011.5734369(91-94)Online publication date: Jan-2011
https://doi.org/10.1109/MEMSYS.2011.5734369
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