Performance modeling and optimization for single- and multi-wall carbon nanotube interconnects

ABSTRACT

Based on physical circuit models the performances of signal and power interconnects at the local, semi-global and global levels are modeled at 100°C. For local signal interconnects, replacing copper wires with a typical aspect ratio of 2 by thin SWNT interconnects can lower power dissipation by 50%. This would also improve their speed by up to 50% by the end of the ITRS. Copper wires and large diameter MWNTs offer the lowest resistance for power distribution in the first and second interconnect levels, respectively. SWNT-bundles and MWNTs can be used to lower the delay of signal interconnects in semi-global levels. MWNTs with diameters of 50nm and 100nm can potentially increase the bandwidth density of global interconnects by up to 50% and 100%, respectively.

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Index Terms

• Hardware

  • Emerging technologies

  • Very large scale integration design