A fast band-matching technique for interconnect inductance modeling
Pages 568 - 571
Abstract
Sparsification of the inverse of inductance matrix L has been widely used to facilitate the interconnect simulation. The band-matching proposed in [5] was proven to be stable and optimal. However, the technique in [5] exhibits a cubic computation complexity. In this paper, we reveal additional relationship between the entries in band-matching inductance matrices. We propose a fast technique that can calculate the entries in the band-matching approximation, in linear computational time. Experiments show accurate results for proposed method with orders of magnitude improvement in computational time.
References
[1]
M. Beattie and L. Pileggi. Modeling magnetic coupling for on-chip interconnect. In Proc. Design Automation Conf., pages 335--340, 2001.
[2]
T. H. Chen, C. Luk, H. Kim, and C. C.-P. Chen. INDUCTWISE: Inductance-wise interconnect simulator and extractor. In Proc. Int. Conf. on Computer Aided Design, pages 215--220, 2002.
[3]
A. Devgan, H. Ji, and W. Dai. How to efficiently capture on-chip inductance effects: Introducing a new circuit element k. In Proc. Int. Conf. on Computer Aided Design, pages 150--155, 2000.
[4]
H. Ji, A. Devgan, and W. Dai. KSim: a stable and efficient RKC simulator for capturing on-chip inductance effect. In Proc. Asia South Pacific Design Automation Conf., pages 379--384, 2001.
[5]
H. Li, V. Balakrishnan, and C.-K. Koh. Stable and compact inductance modeling of 3-d interconnect structures. In Proc. Int. Conf. on Computer Aided Design, pages 1--6, 2007.
[6]
G. Zhong, C.-K. Koh, and K. Roy. On-chip interconnect modeling by wire duplication. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 22:1521--1532, 2003.
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- CEDA: Council on Electronic Design Automation
- SIGDA: ACM Special Interest Group on Design Automation
- IEEE CASS/CANDE
- IEEE-CS\DATC: IEEE Computer Society
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IEEE Press
Publication History
Published: 05 November 2007
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- Research-article
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ICCAD07
Sponsor:
- CEDA
- SIGDA
- IEEE-CS\DATC
ICCAD07: The International Conference on Computer-Aided Design 2007
November 5 - 8, 2007
California, San Jose
Acceptance Rates
ICCAD '07 Paper Acceptance Rate 139 of 510 submissions, 27%;
Overall Acceptance Rate 457 of 1,762 submissions, 26%
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