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Including inductance in static timing analysis

Published: 05 November 2007 Publication History

Abstract

In this paper analytical expressions are derived for effective load capacitances of RLC interconnects to accurately estimate both the propagation delay and transition time at the output of a CMOS gate. The new effective capacitance calculation technique poses no extra complexity as compared to the RC based approaches but can accommodate inductance. These new expressions are derived based on a generalized driving point admittance. The generalized driving point admittance takes inductance into consideration and hence accounts for the inductive shielding that in some cases can even exceed the resistive shielding in current technologies. Another improvement in the new effective capacitance calculation method is the utilization of a more general waveform shape that accounts for the non-monotonic behavior due to inductance effects. It is shown throughout the paper that two effective capacitances are required for accurate estimation of the propagation delay and rise time with an RLC interconnect load. Simulation results show that the error in propagation delays and rise times when neglecting inductance can be over 60% as compared to an RLC model in realistic interconnects. On the other hand, simulations show that the propagation delay and rise time maximum errors associated with the proposed approach are less than 10% as compared to SPICE.

References

[1]
J. Qian, S. Pullela, and L. T. Pillage, "Modeling the 'effective capacitance of RC interconnect," IEEE Trans. Computer-Aided Design, vol. 13, pp. 1526--1535, Dec. 1994
[2]
S. Nassif and Z. Li, "A more effective Ceff" in Proc of the Sixth International Symposium on Quality Electronic Design (ISQED'05)
[3]
A. Ramalingam, A. Singh, S. Nassif, G. Nam, M. Orshansky, D. Pan "An Accurate Sparse Matrix Based Framework for Statistical Static Timing Analysis", ICCAD 2006
[4]
R. E. Mains, T. A. Mosher, L. P. P. P. van Ginneken, and R. F. Damiano, "Timing verification and optimization for the PowerPC processor family," in Proc. Int. Conf. Computer Design, 1994, pp. 390--393
[5]
C. Ratzlaff. S. Pullela, and L. T. Pillage, "Modeling the RC interconnect effects in a hierarchical timing analyzer," in Proc. Custom Integrated Circuits Conf., May 1992
[6]
S Savastiouk, O. Siniaguine, and E. Korczynski, "Thru-Silicon Vias for 3D WLP" International Symposium on Advanced Packaging Materials 2000, pp. 206--207
[7]
G. Kim. D. G. Kam, D. Chung, and J. Kim., "Chip-Package Co Design of Power Distribution Network for System-in-Package Applications" IEEE Electronics Packaging Technology Conference 2004, PP. 499--501
[8]
P. R. O'Brien and T. L. Savarino, "Modeling the driving point characteristic of resistive interconnect for accurate delay estimation," in Pin(Int. Con6 Computer-Aided Design, Nov. 1989.
[9]
Y. I. Ismail, E. G. Friedman, and J. L. Neves, "Figures of Merit to Characterize the Importance of On-Chip Inductance", IEEE Transactions on Very Large Scale Integration Systems (TVLSI), vol. 7, no. 4, pp. 442--449, December 1999
[10]
Y. I. Ismail, E. G. Friedman, and J. L. Neves, "Equivalent Elmore Delay for RLC Trees", IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), vol. 19, no. 1, pp. 83--97, January 2000
[11]
D. B. Jarvis, "The Effects of Interconnections on High- Speed Logic Circuits," IEEE Transactions on Electronic Computers, Vol. EC-10, No. 4, pp. 476--487, October 1963.
[12]
A. Deutsch, et al., "When are transmission-line effects important for on-chip interconnections?," IEEE Transactions on Microwave Theory and Techniques, Vol. 45, No. 10, pp. 1836--1846, October 1997.
[13]
J. Torres, "Advanced Copper Interconnections for Silicon CMOS Technologies," Applied Surface Science, Vol. 91, No. 1, pp. 112--123, October 1995.

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  • (2021)Cross-Boundary Inductive Timing Optimization for 2.5D Chiplet-Package Co-DesignProceedings of the 2021 on Great Lakes Symposium on VLSI10.1145/3453688.3461505(135-140)Online publication date: 22-Jun-2021
  1. Including inductance in static timing analysis

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    cover image ACM Conferences
    ICCAD '07: Proceedings of the 2007 IEEE/ACM international conference on Computer-aided design
    November 2007
    933 pages
    ISBN:1424413826
    • General Chair:
    • Georges Gielen

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    IEEE Press

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    Published: 05 November 2007

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    • (2021)Cross-Boundary Inductive Timing Optimization for 2.5D Chiplet-Package Co-DesignProceedings of the 2021 on Great Lakes Symposium on VLSI10.1145/3453688.3461505(135-140)Online publication date: 22-Jun-2021

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