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View all- Chen XPourbakhsh SFu JGong NWang J(2018)A Novel Hybrid Delay Unit Based on Dummy TSVs for 3-D On-Chip MemoryIEEE Transactions on Very Large Scale Integration (VLSI) Systems10.1109/TVLSI.2018.280996126:7(1277-1289)Online publication date: 1-Jul-2018