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Hierarchical distributed simulation for 300mm wafer fab

Published:09 December 2007Publication History

ABSTRACT

Distributed simulation promises benefits in large-scale simulations, such as in high fidelity simulation of 300mm wafer fabs, although these benefits have been hard to achieve in practice. This paper examines the fundamentals of distributed simulation, and proposes a hierarchical approach to distributed wafer fab simulation, which has the potential to achieve significant reduction in model execution time.

References

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  • Published in

    cover image ACM Conferences
    WSC '07: Proceedings of the 39th conference on Winter simulation: 40 years! The best is yet to come
    December 2007
    2659 pages
    ISBN:1424413060

    Publisher

    IEEE Press

    Publication History

    • Published: 9 December 2007

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    • research-article

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    WSC '07 Paper Acceptance Rate152of244submissions,62%Overall Acceptance Rate3,413of5,075submissions,67%
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