skip to main content
10.5555/1357910.1357954acmotherconferencesArticle/Chapter ViewAbstractPublication PagesscscConference Proceedingsconference-collections
research-article

Damage mechanics modeling of concurrent thermal and vibration loading on electronics packaging

Published: 16 July 2007 Publication History

Abstract

The problem of concurrent thermal and vibration loading has not been thoroughly studied even though it is common in electronic packaging applications. Here we attempt to address such a problem using a damage mechanics based constitutive model. Damage mechanics constitutive model for eutectic Pb/Sn solder alloys is used to simulate the damage effects of concurrent cyclic thermal loads and vibrations on electronics packages. The model is implemented into the commercial finite element code ABAQUS through its user defined material subroutine capability. For the integration algorithm we have used a return mapping scheme, which dramatically improves the convergence rate as compared to previous implementations of the same model. Results are examined in terms of accumulation of plastic strain within the solder connections. It is shown that the simplistic Miner's rule can not accurately account for the combined effect of both loadings acting concurrently.

References

[1]
Basaran, C., Y. Zhao, H. Tang, and J. Gomez. "A Damage Mechanics Based Constitutive Model for Joints." ASME Journal of Electronic Packaging 127 (2005): 1--7.
[2]
Simo, J., and T. Hughes. Computational Inelasticity. 7 vols. Vol. 7, Interdisciplinary Applied Mathematics: Springer, 1998.
[3]
Tang, H. "A Thermodynamic Damage Mechanics Theory and Experimental Verification for Thermomechanical Fatigue Life Prediction of Microelectronics Solder Joints." The State University of New York at Buffalo, 2002.
[4]
Basaran, C., and H. Tang. "Implementation of a Thermodynamic Framework for Damage Mechanics of Solder Interconnect in Microelectronic Packaging." Paper presented at the Proceedings of IMECE, New Orleans, Louisiana 2002.
[5]
Owen, D. R. J., and E. Hinton. Finite Element in Plasticity. Swansea, U.K.: Pineridge Press Limited, 1980.
[6]
Zhao, Y., C. Basaran, A. Cartwright, and T. Dishongh. "Thermomechanical Behavior of Micron Scale Solder Joints: An Experimental Observation." Journal Of Mechanical Behavior of Materials 10, no. 3 (1999): 135--46.
[7]
Barker, D., J. Vodzak, A. Dashgupta, and M. Pecht. "Combined Vibrational and Thermal Solder Joint Fatigue. A Generalized Strain Versus Life Approach." ASME Journal of Electronic Packaging 2 (1990): 129--34.
[8]
Miner, M. A. "Cumulative Damage in Fatigue." ASME Journal of Applied Mechanics (1945).
[9]
Lubarda, V., and D. Benson. "On the Numerical Algorithm for Isotropic-Kinematic Hardening with the Armstrong-Frederick Evolution of the Back Stress." Computational Methods Applied Mechanics Engineering 191 (2002): 3583--96.
[10]
Alfano, G., F. Angelis, and L. Rosati. "General Solution Procedures in Elasto/Viscoplasticity." Computational Methods Applied Mechanics Engineering 190 (2001): 5123--47.
[11]
Chaboche, J. "Constitutive Equations for Cyclic Plasticity and Viscoplasticity." International Journal of Plasticity 3 (1989): 247--302.
[12]
Armstrong, P. J., and C. O. Frederick. "A Mathematical Representation of the Multiaxial Bauschinger Effect." CEGB Report RD/B/N731, 1996.
[13]
Prager, W. "A New Method of Analyzing Stress and Strains in Work-Hardening Plastic Solids." Journal of Applied Mechanics 23 (1956): 493--96.
[14]
Lemaitre, J. A Course on Damage Mechanics. Germany: Springer-Verlag., 1996.
[15]
Basaran, C., and C. Yan. "A Thermodynamic Framework for Damage Mechanics of Solder Joints." Journal of Electronic Packaing, Trans. ASME 120 (1998): 379--84.
[16]
Gomez, J., and C. Basaran. "Numerical Simulation of Monotonic and Fatigue Shear Testing of Thin Layer Solder Joints Using a Damage Mechanics Based Constitutive Model." Paper presented at the Proceedings 2003 ASME Mechanics and Materials Conference, Scottsdale, Arizona 2003.
[17]
Pecht, M., R. Agarwal, P. Mc Cluskey, T. Dishong, S. Javadpour, and R. Mohajan. Electronic Packaging Materials and Their Properties: CRC press, 1999.

Recommendations

Comments

Information & Contributors

Information

Published In

cover image ACM Other conferences
SCSC '07: Proceedings of the 2007 Summer Computer Simulation Conference
July 2007
1363 pages
ISBN:1565553160

Sponsors

  • SCS: Society for Modeling and Simulation International

In-Cooperation

Publisher

Society for Computer Simulation International

San Diego, CA, United States

Publication History

Published: 16 July 2007

Check for updates

Author Tags

  1. concurrent loading
  2. dynamic analysis
  3. electronics packaging reliability
  4. solder joint life prediction

Qualifiers

  • Research-article

Conference

SCSC07
Sponsor:
  • SCS
SCSC07: 2007 Summer Computer Simulation Conference
July 16 - 19, 2007
California, San Diego

Contributors

Other Metrics

Bibliometrics & Citations

Bibliometrics

Article Metrics

  • 0
    Total Citations
  • 233
    Total Downloads
  • Downloads (Last 12 months)1
  • Downloads (Last 6 weeks)0
Reflects downloads up to 27 Jan 2025

Other Metrics

Citations

View Options

Login options

View options

PDF

View or Download as a PDF file.

PDF

eReader

View online with eReader.

eReader

Figures

Tables

Media

Share

Share

Share this Publication link

Share on social media