skip to main content
10.1145/1391469.1391632acmconferencesArticle/Chapter ViewAbstractPublication PagesdacConference Proceedingsconference-collections
panel

Keeping hot chips cool: are IC thermal problems hot air?

Published: 08 June 2008 Publication History

Abstract

Thermal issues are becoming more important but is the hype getting the better of the facts? Does this deserve more attention than for some niche designs and technologies such as 3D ICs.? Does the broader design community need to worry about it at 32nm and beyond or it will only impact a small segment of designs? In short, does the severity of power issues coupled with packaging complexity translate into a thermal crisis in future? This is an educational panel with a little bit of controversy that will address the thermal issue in IC design. When will this issue be emerging as a crucial concern if at all? What are the solutions to resolve this potential crisis?

Cited By

View all
  • (2016)Early Stage Automatic Strategy for Power-Aware Signal Processing Systems DesignJournal of Signal Processing Systems10.1007/s11265-015-0999-z82:3(311-329)Online publication date: 1-Mar-2016

Index Terms

  1. Keeping hot chips cool: are IC thermal problems hot air?

    Recommendations

    Comments

    Information & Contributors

    Information

    Published In

    cover image ACM Conferences
    DAC '08: Proceedings of the 45th annual Design Automation Conference
    June 2008
    993 pages
    ISBN:9781605581156
    DOI:10.1145/1391469
    • General Chair:
    • Limor Fix
    Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than ACM must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from [email protected]

    Sponsors

    Publisher

    Association for Computing Machinery

    New York, NY, United States

    Publication History

    Published: 08 June 2008

    Permissions

    Request permissions for this article.

    Check for updates

    Author Tags

    1. VLSI design
    2. power dissipation
    3. thermal management

    Qualifiers

    • Panel

    Conference

    DAC '08
    Sponsor:

    Acceptance Rates

    Overall Acceptance Rate 1,770 of 5,499 submissions, 32%

    Upcoming Conference

    DAC '25
    62nd ACM/IEEE Design Automation Conference
    June 22 - 26, 2025
    San Francisco , CA , USA

    Contributors

    Other Metrics

    Bibliometrics & Citations

    Bibliometrics

    Article Metrics

    • Downloads (Last 12 months)1
    • Downloads (Last 6 weeks)0
    Reflects downloads up to 15 Feb 2025

    Other Metrics

    Citations

    Cited By

    View all
    • (2016)Early Stage Automatic Strategy for Power-Aware Signal Processing Systems DesignJournal of Signal Processing Systems10.1007/s11265-015-0999-z82:3(311-329)Online publication date: 1-Mar-2016

    View Options

    Login options

    View options

    PDF

    View or Download as a PDF file.

    PDF

    eReader

    View online with eReader.

    eReader

    Figures

    Tables

    Media

    Share

    Share

    Share this Publication link

    Share on social media