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View all- Pan DYu BGao J(2013)Design for Manufacturing With Emerging NanolithographyIEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems10.1109/TCAD.2013.227675132:10(1453-1472)Online publication date: 1-Oct-2013
Due to the sub-wavelength lithography, manufacturing sub-90 nm feature sizes require intensive use of resolution-enhancement techniques, among which optical proximity correction (OPC) is the most popular technique in industry. Considering the OPC ...
As the technology nodes scale down to 22nm and beyond, Double Patterning Lithography (DPL) has been considered as a practical solution for manufacturing process. Compared with Litho-Etch-Litho-Etch (LELE), Self-Aligned Double Patterning (SADP) has ...
As integrated circuit technology nodes continue to shrink, dense via distribution becomes a severe challenge, requiring multiple masks to avoid spacing violations in via layers. Meanwhile, the directed self-assembly (DSA) technique shows a great promise ...
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