Ahmed Jerraya
ABSTRACT
3-D ICs enable dramatically improved. 3D integration and is expected to be a serious alternative to below 45 nm technology to continue the race toward integration at lower cost. Improvements of density of integration and performances will continue thanks to wire length reduction. Additionally, 3D enables an easier mix of technology in the same IC. The success of these new ICs depends on the availability of new methodologies and skills that are required to achieve acceptable design quality and productivity. This talk addresses technology trends and design challenges for 3D integration.
Index Terms
- System design for 3D Silicon integration
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