Topol, A. W., La Tulipe, D. C., Shi, L., Alam, S. M., Frank, D. J., Steen, S. E., Vichiconti, J., Posillico, D., Cobb, M., Medd, S., Patel, J., Goma, S., DiMilia, D., Robson, M. T., Duch, E., Farinelli, M, Wang, C., Conti, R. A., Canaperi, L., Deligianni, A., Kummar, A., Kwietniak, K. T., D'emic, C., Ott, J., Young, A. M., Guarini, K. W., and Leong, M. 2005. Enabling SOI-based assembly technology for three-dimensional (3D) integrated circuits (ICs). In IEEE International Electronic Devices Meeting Conference Digest Technology Papers, 363--366.