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Temperature-aware register reallocation for register file power-density minimization

Published: 07 April 2009 Publication History

Abstract

Increased chip temperature has been known to cause severe reliability problems and to significantly increase leakage power. The register file has been previously shown to exhibit the highest temperature compared to all other hardware components in a modern high-end embedded processor, which makes it particularly susceptible to faults and elevated leakage power. We show that this is mostly due to the highly clustered register file accesses where a set of few registers physically placed close to each other are accessed with very high frequency. We propose compile-time temperature-aware register reallocation methodologies for breaking such groups of registers and to uniformly distribute the accesses to the register file. This is achieved with no performance and no hardware overheads. We show that the underlying problem is NP-hard, and subsequently introduce and evaluate two efficient algorithmic heuristics. Our extensive experimental study demonstrates the efficiency of the proposed methodology.

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        Published In

        cover image ACM Transactions on Design Automation of Electronic Systems
        ACM Transactions on Design Automation of Electronic Systems  Volume 14, Issue 2
        March 2009
        384 pages
        ISSN:1084-4309
        EISSN:1557-7309
        DOI:10.1145/1497561
        Issue’s Table of Contents
        Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than ACM must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from [email protected]

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        Publication History

        Published: 07 April 2009
        Accepted: 01 December 2008
        Revised: 01 August 2008
        Received: 01 April 2008
        Published in TODAES Volume 14, Issue 2

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        View all
        • (2018)Evolutionary design of the memory subsystemApplied Soft Computing10.1016/j.asoc.2017.09.04762(1088-1101)Online publication date: Jan-2018
        • (2012)Wearout-aware compiler-directed register assignment for embedded systemsThirteenth International Symposium on Quality Electronic Design (ISQED)10.1109/ISQED.2012.6187471(33-40)Online publication date: Mar-2012
        • (2011)Dynamic Voltage Adjustment for Energy Efficient Scheduling on Multi-core SystemsProceedings of the 2011 IEEE Ninth International Symposium on Parallel and Distributed Processing with Applications Workshops10.1109/ISPAW.2011.73(197-202)Online publication date: 26-May-2011
        • (2010)Thermal-aware compilation for system-on-chip processing architecturesProceedings of the 20th symposium on Great lakes symposium on VLSI10.1145/1785481.1785535(221-226)Online publication date: 16-May-2010
        • (2010)Thermal-Aware Compilation for Register Window-Based Embedded ProcessorsIEEE Embedded Systems Letters10.1109/LES.2010.20813432:4(103-106)Online publication date: 1-Dec-2010

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