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Overall thermal simulation of electronic equipment

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Published:23 September 1994Publication History
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References

  1. 1.Laramx, C.J.M. Thermal Ifanaement of air-cooled electronic systems: new challenges for reseat& proceedings of Eurotherm Seminar No. 29. pp. 3-24, Kluwer Academic publishers (june 1993).Google ScholarGoogle Scholar
  2. 2.Le hmou, J.P., Huon, Y. Representation of Thermal Behavior of Electronic Components for the Creation of a Databank, IEEE transactions on components, hybrids, and manufacturing technology, vol. 14, M. 2, pp. 366-373 (june 1991)Google ScholarGoogle Scholar
  3. 3.Gauthier, T., Cowtruction atui Vdidation of Thermal Mnfel of Packages, 7th annual IEEE Semitherm 91, pp. 74-79 (1991).Google ScholarGoogle Scholar
  4. 4.Huebner, K.H. The Finite Element Model for Engineers, Wiley & Scms. p. 155 (1975).Google ScholarGoogle Scholar
  5. 5.Blanchard, J.L. Morelle. J.M. Two Thermal Simulation Approaches for the Electronic Equ&nent, 6th conf. on interconnection technologies for extreme integration, hfilan. pp. 207-216 (sept 92).Google ScholarGoogle Scholar

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      • Published in

        cover image ACM Conferences
        EURO-DAC '94: Proceedings of the conference on European design automation
        September 1994
        697 pages
        ISBN:0897916859

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        IEEE Computer Society Press

        Washington, DC, United States

        Publication History

        • Published: 23 September 1994

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