research-article

Thermal-aware task scheduling in 3D chip multiprocessor with real-time constrained workloads

Authors:

Laurence T. Yang,

Zhong MingAuthors Info & Claims

ACM Transactions on Embedded Computing Systems (TECS), Volume 12, Issue 2

Article No.: 24, Pages 1 - 22

https://doi.org/10.1145/2423636.2423642

Published: 22 February 2013 Publication History

Abstract

Chip multiprocessor (CMP) techniques have been implemented in embedded systems due to tremendous computation requirements. Three-dimension (3D) CMP architecture has been studied recently for integrating more functionalities and providing higher performance. The high temperature on chip is a critical issue for the 3D architecture. In this article, we propose an online thermal prediction model for 3D chips. Using this model, we propose novel task scheduling algorithms based on rotation scheduling to reduce the peak temperature on chip. We consider data dependencies, especially inter-iteration dependencies that are not well considered in most of the current thermal-aware task scheduling algorithms. Our simulation results show that our algorithms can efficiently reduce the peak temperature up to 8.1^ˆC.

References

[1]

Allec, N., Hassan, Z., Shang, L., Dick, R. P., and Yang, R. 2008. Thermalscope: Multi-scale thermal analysis for nanometer-scale integrated circuits. In Proceedings of the ACM/IEEE International Conference on Computer Aided Design (ACM/IEEE ICCAD). 75--82.

Digital Library

[2]

Ayoub, R. and Rosing, T. S. 2009. Predict and act: dynamic thermal management for multi-core processors. In Proceeding of the 2009 International Symposium on Low Power Electronics and Design (ISLPED'09). ACM, 99--104.

Digital Library

[3]

Black, B., Annavaram, M., Brekelbaum, N., DeVale, J., Jiang, L., Loh, G. H., McCaule, D., Morrow, P., Nelson, D. W., and Pantuso, D. 2006. Die stacking (3D) microarchitecture. In Proceedings of the 39th Annual IEEE/ACM International Symposium on Microarchitecture. 469--479.

Digital Library

[4]

Brooks, D., Tiwari, V., and Martonosi, M. 2000. WATTCH: A framework for architectural-level power analysis and optimizations. In Proceedings of the IEEE Annual International Symposium on Computer Architecture (IEEE ISCA). 83--94.

Digital Library

[5]

Chao, L.-F., LaPaugh, A., and Sha, E. H.-M. 1997. Rotation scheduling: A loop pipelining algorithm. IEEE Trans. Comput. Aided Design Integ. Circ. Syst. 16, 3 (Mar.), 229--239.

Digital Library

[6]

Chaparro, P., González, J., Cai, Q., and Chrysler, G. 2009. Dynamic thermal management using thin-film thermoelectric cooling. In Proceedings of the 2009 International Symposium on Low Power Electronics and Design (ISLPED'09). ACM, 111--116.

Digital Library

[7]

Coskun, A., Rosing, T., and Gross, K. 2008. Proactive temperature balancing for low cost thermal management in MPSoCs. In Proceedings of the ACM/IEEE International Conference on Computer-Aided Design (ACM/IEEE ICCAD).

Digital Library

[8]

Coskun, A. K., Ayala, J. L., Atienza, D., Rosing, T. S., and Leblebici, Y. 2009. Dynamic thermal management in 3D multicore architectures. In Proceedings of the ACM/IEEE Conference and Exhibition on Design, Automation, and Test in Europe (DATE). 1410--1415.

Digital Library

[9]

Han, Y., Koren, I., and Moritz, C. A. 2005. Temperature aware floorplanning. In Proceedings of the Workshop on Temperature-Aware Computer Systems.

[10]

Ibarra, O. H. and Kim, C. E. 1977. Heuristic algorithms for scheduling independent tasks on nonidentical processors. J. ACM 24, 2, 280--289.

Digital Library

[11]

JEDEC. 2009. Failure mechanisms and models for semiconductor devices. http://www.jedec.org.

[12]

Kessler, R. E. 1999. The Alpha 21264 microprocessor. IEEE Micro 19, 2, 24--36.

Digital Library

[13]

Lin, C., Yang, C., and King, K. 2009. PPT: joint performance/power/thermal management of DRAM memory for multi-core systems. In Proceedings of the 2009 International Symposium on Low Power Electronics and Design (ISLPED'09). ACM, 93--98.

Digital Library

[14]

Liu, S. and Qiu, M. 2010. Thermal-aware scheduling for peak temperature reduction with stochastic workloads. In Proceedings of the IEEE Real-Time and Embedded Technology and Appreciation Symposium (IEEE/ACM RTAS).

[15]

Liu, S., Zhang, J., Wu, Q., and Qiu, Q. 2010. Thermal-aware job allocation and scheduling for three dimensional chip multiprocessor. In Proceedings of the IEEE International Symposium on Quality Electronic Design. 390--398.

[16]

Mosse, D., Aydin, H., Childers, B., and Melhem, R. 2000. Compiler-assisted dynamic power-aware scheduling for real-time applications. In Proceedings of the Workshop on Compilers and Operating Systems for Low-Power.

[17]

Mulas, F., Pittau, M., Buttu, M., Carta, S., Acquaviva, A., Benini, L., and Atienza, D. 2008. Thermal balancing policy for streaming computing on multiprocessor architectures. In Proceedings of the ACM/IEEE Conference and Exhibition on Design, Automation, and Test in Europe (DATE). 734--739.

Digital Library

[18]

Nookala, V., Lilja, D. J., and Sapatnekar, S. S. 2006. Temperature-aware floorplanning of microarchitecture blocks with IPC-power dependence modeling and transient analysis. In ACM/IEEE ISLPED. 298--303.

Digital Library

[19]

Pathak, M. and Lim, S. 2008. Thermal-aware steiner routing for 3D stacked ICs. In Proceedings of the ACM/IEEE International Conference on Computer-Aided Design (ICCAD). 205--211.

Digital Library

[20]

Puttaswamy, K. and Loh, G. 2007. Thermal herding: microarchitecture techniques for controlling hotspots in high-performance 3d-integrated processors. In Proceedings of the IEEE International Symposium on High-Performance Computer Architecture (HPCA). 193--204.

Digital Library

[21]

Qiu, M., Yang, L., Shao, Z., and Sha, E. H.-M. 2010. Dynamic and leakage energy minimization with soft real-time loop scheduling and voltage assignment. IEEE Trans. TVLSI Syst. 18, 3, 501--504.

Digital Library

[22]

Qiu, M., Jia, Z., Xue, C., Shao, Z., and Sha, E. H. M. 2007. Voltage assignment with guaranteed probability satisfying timing constraint for real-time multiproceesor DSP. J. VLSI Sig. Proc. 46, 1, 55--73.

Digital Library

[23]

Qiu, M. and Sha, E. H.-M. 2009. Cost minimization while satisfying hard/soft timing constraints for heterogeneous embedded systems. ACM Trans. Design Automat. Electron. Syst. 14, 2, 1--30.

Digital Library

[24]

Qiu, M., Yang, L., Shao, Z., and Sha, E. H.-M. 2009. Rotation scheduling and voltage assignment to minimize energy for SoC. In Proceedings of the International Conference on Computational Science and Engineering. 48--55.

Digital Library

[25]

Sankaranarayanan, K., Velusamy, S., Stan, M., and Skadron, K. 2005. A case for thermal-aware floorplanning at the microarchitectural level. IEEE Trans. Comput. Aided Des. Integ. Circ. Syst. 7, 1--16.

[26]

Shin, D., Kim, J., and Lee, S. 2001. Intra-task voltage scheduling for low-energy, hard real-time applications. IEEE Des. Test Comput. 18, 2, 20--30.

Digital Library

[27]

Shivle, S., Castain, R., Siegel, H. J., et al. 2004. Static mapping of subtasks in a heterogeneous ad hoc grid environment. In Proceedings of the 13th IEEE Heterogeneous Computing Workshop (HCW 2004).

[28]

Shivle, S., Siegel, H. J., Maciejewski, A. A., et al. 2006. Static allocation of resources to communicating subtasks in a heterogeneous ad hoc grid environment. J. Parall. Distrib. Comput. 66, 4, 600--611.

Digital Library

[29]

Skadron, K., Stan, M., Sankaranarayanan, K., Huang, W., Velusamy, S., and Tarjan, D. Mar. 2004. Temperature-aware microarchitecture: Modeling and implementation. ACM Trans. Architect. Code Optim. 1, 1, 94--125.

Digital Library

[30]

Tian, Y. and Ekici, E. 2007. Cross-layer collaborative in-network processing in multihop wireless sensor networks. IEEE Trans. Mob. Comput. 6, 3, 297--310.

Digital Library

[31]

Tian, Y., Ekici, E., and Ozguner, F. 2005. Energy-constrained task mapping and scheduling in wireless sensor networks. In Proceedings of the IEEE International Conference on Mobile Adhoc and Sensor Systems Conference. 211--218.

[32]

Topol, A. W., La Tulipe Jr., D. C., and Shi, L. 2006. Three-dimensional integrated circuits. IBM J. Res. Development 50, 4/5, 491--506.

Digital Library

[33]

Weiser, M., Welch, B., Demers, A., and Shenker, S. 1994. Scheduling for reduced CPU energy. In Proceedings of the 1st USENIX Conference on Operating Systems Design and Implementation.

Digital Library

[34]

Yao, F., Demers, A., and Shenker, S. 1995. A scheduling model for reduced CPU energy. In Proceedings of the 36th Annual Symposium on Foundations of Computer Science (FOCS'95). 374--382.

Digital Library

[35]

Zhou, P., Ma, Y., Li, Z., Dick, R. P., Shang, L., Zhou, H., Hong, X., and Zhou, Q. 2008. 3D-STAF: scalable temperature and leakage aware floorplanning for three-dimensional integrated circuits. In Proceedings of the ACM/IEEE International Conference on Computer-Aided Design (ICCAD). 590--597.

Digital Library

[36]

Zhou, X., Yang, J., Xu, Y., Zhang, Y., and Zhao, J. 2010. Thermal-aware task scheduling for 3D multicore processors. IEEE Trans. Panal. Distr. Syst. 21, 1 (Jan.), 60--70.

Digital Library

[37]

Zhu, C., Gu, Z., Shang, L., Dick, R. P., and Joseph, R. 2008. Three-dimensional chip-multiprocessor run-time thermal management. IEEE Trans. Comput. Aided Des. Integ. Circ. Syst. 27, 8 (Aug.), 1479--1492.

Digital Library

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Index Terms

Thermal-aware task scheduling in 3D chip multiprocessor with real-time constrained workloads
1. Computer systems organization
  1. Embedded and cyber-physical systems
  2. Real-time systems

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Published In

cover image ACM Transactions on Embedded Computing Systems

ACM Transactions on Embedded Computing Systems Volume 12, Issue 2

Special issue on embedded systems for interactive multimedia services (ES-IMS)

February 2013

209 pages

ISSN:1539-9087

EISSN:1558-3465

DOI:10.1145/2423636

Issue’s Table of Contents

Copyright © 2013 ACM.

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Association for Computing Machinery

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ACM Journals for the Design of Smart and Connected Systems

Publication History

Published: 22 February 2013

Accepted: 01 March 2011

Revised: 01 March 2011

Received: 01 November 2010

Published in TECS Volume 12, Issue 2

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Funding Sources

Shanghai International S&T Collaboration Program (09540701900)
University of Kentucky
State Key Lab of Software Development Environment
Ministry of Science and Technology of the People's Republic of China
National Natural Science Foundation of China
SZ-HK Innovation Circle project ZYB200907060012A, NSF GD:10351806001000000, S&T project of SZ JC200903120046A, S&T Project of GD 2012B091100198

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