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A SPH-based dissolution behavior model for real-time fluid-solid interaction

Published: 24 November 2014 Publication History

Abstract

Interactions among fluids and solids are frequently observed around our daily life and simulated for various purposes. However, real-time simulation of dissolution phenomena, including erosion and liquefying, is restrictively allowed due to the complexity of the behavior model. To lessen this limitation, we suggest a particle-based dissolution model for real-time interaction between the fluids and the soluble solid objects. In our system, both of the fluids and the solid objects consist of the particles based on the unified particle model. Dissolution occurs when the solid object is submerged into the fluid. The concentration of the solid particle is transferred to the adjacent fluid particles during the dissolution. In this process, the total amount of the solute is preserved. Completely dissolved solid particles are detached from the object, and the inertia tensor of the object is renewed to reflect the shape changes. With the updated properties, the system solves rigid body dynamics of the solid object by summing up the local contact responses of the individual particles. The suggested model is parallelized per particle and launched on GPU to enhance the performance.

References

[1]
Cirio, G., Marchal, M., Hillaire, S., and Lecuyer, A. 2011. Six degrees-of-freedom haptic interaction with fluids. IEEE Transactions on Visualization and Computer Graphics 17, 11 (Nov), 1714--1727.
[2]
Rungjiratananon, W., Szego, Z., Kanamori, Y., and Nishita, T. 2008. Real-time animation of sand-water interaction. Computer Graphics Forum 27, 7, 1887--1893.

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          cover image ACM Other conferences
          SA '14: SIGGRAPH Asia 2014 Posters
          November 2014
          47 pages
          ISBN:9781450327923
          DOI:10.1145/2668975
          Permission to make digital or hard copies of part or all of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for third-party components of this work must be honored. For all other uses, contact the Owner/Author.

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          Association for Computing Machinery

          New York, NY, United States

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          Published: 24 November 2014

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          SA'14
          SA'14: SIGGRAPH Asia 2014
          December 3 - 6, 2014
          Shenzhen, China

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          Overall Acceptance Rate 178 of 869 submissions, 20%

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