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abstract

Design method of digitally fabricated spring glass pen

Published:12 August 2018Publication History

ABSTRACT

In this study, We propose a method to develop a spring glass dip pen by using a 3D printer and reproduce different types of writing feeling. There have been several studies on different types of pens to change the feel of writing. For example, EV-Pen [Wang et al. 2016] and haptics pens [Lee et al. 2004] changes the feel of pen writing with using vibration. However, our proposed method does not reproduce tactile sensation of softness by using vibrations.

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References

  1. Johnny C. Lee, Paul H. Dietz, Darren Leigh, William S. Yerazunis, and Scott E. Hudson. 2004. Haptic Pen: A Tactile Feedback Stylus for Touch Screens. In Proceedings of the 17th Annual ACM Symposium on User Interface Software and Technology (UIST '04). ACM, New York, NY, USA, 291--294. Google ScholarGoogle ScholarDigital LibraryDigital Library
  2. Kengo Tanaka, Taisuke Ohshima, and Yoichi Ochiai. 2017. Spring-pen: Reproduction of Any Softness with the 3D Printed Spring. In SIGGRAPH Asia 2017 Posters (SA '17). ACM, New York, NY, USA, Article 37, 2 pages. Google ScholarGoogle ScholarDigital LibraryDigital Library
  3. Qinglong Wang, Xiangshi Ren, and Xiaoying Sun. 2016. EV-pen: An Electrovibration Haptic Feedback Pen for Touchscreens. In SIGGRAPH ASIA 2016 Emerging Technologies (SA '16). ACM, New York, NY, USA, Article 8, 2 pages. Google ScholarGoogle ScholarDigital LibraryDigital Library

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  • Published in

    cover image ACM Conferences
    SIGGRAPH '18: ACM SIGGRAPH 2018 Studio
    August 2018
    43 pages
    ISBN:9781450358194
    DOI:10.1145/3214822

    Copyright © 2018 Owner/Author

    Permission to make digital or hard copies of part or all of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for third-party components of this work must be honored. For all other uses, contact the Owner/Author.

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    Association for Computing Machinery

    New York, NY, United States

    Publication History

    • Published: 12 August 2018

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    Overall Acceptance Rate1,822of8,601submissions,21%

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