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Throughput-driven IC communication fabric synthesis
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Source International Conference on Computer Aided Design archive
Proceedings of the 2002 IEEE/ACM international conference on Computer-aided design table of contents
San Jose, California
Pages: 274 - 279  
Year of Publication: 2002
ISBN ~ ISSN:1092-3152 , 0-7803-7607-2
Authors
Tao Lin  Carnegie Mellon University, Pittsburgh, PA
Lawrence T. Pileggi  Carnegie Mellon University, Pittsburgh, PA
Sponsors
: IEEE Circuits & Systems Society
IEEE-CS\DATC : IEEE Computer Society
SIGDA: ACM Special Interest Group on Design Automation
Publisher
ACM  New York, NY, USA
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Downloads (6 Weeks): 2,   Downloads (12 Months): 15,   Citation Count: 8
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ABSTRACT

As the scale of system integration continues to grow, the on-chip communication becomes the ultimate bottleneck of system performance and the primary determinant of system architecture. In this paper we propose a throughput-driven synthesis methodology for on-chip communication fabrics based on optimized bus models. Compared with traditional delay-driven, wire-by-wire planning methods, the throughput-driven methodology provides a feasible and accurate system-level solution to address delay and congestion problems simultaneously during earlyphase design planning. Unlike the conventional methods which are based on rather inaccurate RC models and simplistic delay metrics, in our methodology the communication fabrics are characterized in terms of realistic Partial Element Equivalent Circuits (PEEC) extracted from the multi-layer interconnects and transistor level transient analysis via SPICE-like tools. The characterized models facilitate a flexible interconnect fabric optimization engine that can be embedded into a system planner for throughput-driven synthesis. Furthermore, engineering trade-offs considering repeater area and interconnect power consumption are further considered as part of this methodology.


REFERENCES

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CITED BY  8
 
 
 

Collaborative Colleagues:
Tao Lin: colleagues
Lawrence T. Pileggi: colleagues

Peer to Peer - Readers of this Article have also read: