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Performance-impact limited area fill synthesis
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Source Annual ACM IEEE Design Automation Conference archive
Proceedings of the 40th conference on Design automation table of contents
Anaheim, CA, USA
SESSION: Design for manufacturability and global routing table of contents
Pages: 22 - 27  
Year of Publication: 2003
ISBN:1-58113-688-9
Authors
Yu Chen  UCLA, Los Angeles, CA
Puneet Gupta  UCSD, La Jolla, CA
Andrew B. Kahng  UCSD, La Jolla, CA
Sponsor
ACM: Association for Computing Machinery
Publisher
ACM  New York, NY, USA
Bibliometrics
Downloads (6 Weeks): 1,   Downloads (12 Months): 19,   Citation Count: 8
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ABSTRACT

Chemical-mechanical planarization (CMP) and other manufacturing steps in very deep-submicron VLSI have varying effects on device and interconnect features, depending on the local layout density. To improve manufacturability and performance predictability, area fill features are inserted into the layout to improve uniformity with respect to density criteria. However, the performance impact of area fill insertion is not considered by any fill method in the literature. In this paper, we first review and develop estimates for capacitance and timing overhead of area fill insertions. We then give the first formulations of the Performance Impact Limited Fill (PIL-Fill) problem with the objective of either minimizing total delay impact (MDFC) or maximizing the minimum slack of all nets (MSFC), subject to inserting a given prescribed amount of fill. For the MDFC PIL-Fill problem, we describe three practical solution approaches based on Integer Linear Programming (ILP-I and ILP-II) and the Greedy method. For the MSFC PIL-Fill problem, we describe an iterated greedy method that integrates call to an industry static timing analysis tool. We test our methods on layout testcases obtained from industry. Compared with the normal fill method [3], our ILP-II method for MDFC PIL-Fill problem achieves between 25-% and 90% reduction in terms of total weighted edge delay (roughly, a measure of sum of node slacks) impact while maintaining identical quality of the layout density control; and our iterated greedy method for MSFC PIL-Fill problem also shows significant advantage with respect to the minimum slack of nets on post-fill layout.


REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

 
1
N. D. Arora, K. V. Raol, R. Schumann, and L. M. Richardson, "Modeling and Extraction of Interconnect Capacitances for Multi-layer VLSI Circuits," IEEE Trans. on Computer-Aided Design 15(1) (1996), pp. 58--67.
 
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3
Y. Chen, A. B. Kahng, G. Robins and A. Zelikovsky, "Dummy Fill Synthesis for Uniform Layout Density", IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems 21(10) (2002), pp. 1132--1147.
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5
J. Chern, J. Huang, L. Aldredge, P. Li and P. Yang, "Multilevel Metal Capacitance Models for Interconnect Capacitances", IEEE Electron Device Lett EDL-14 (1992), pp. 32--43.
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W. C. Elmore, "The Transient Response of Damped Linear Networks with Particular Regard to Wideband Amplifiers", Journal of Applied Physics (1948), pp. 55--63.
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10
Praesagus, Inc., http://www.praesagus.com/
 
11
B. E. Stine, D. S. Boning et al., "The Physical and Electrical Effects of Metal Fill Patterning Practices for Oxide Chemical Mechanical Polishing Processes", IEEE Trans. on Electron Devices 45(3) (1998), pp. 665--679.
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13
UbiTech. Inc., http://www.ubitechnology.com/
 
14
XYALIS, http://www.xyalis.com/

CITED BY  8
 
 
 
 
 

Collaborative Colleagues:
Yu Chen: colleagues
Puneet Gupta: colleagues
Andrew B. Kahng: colleagues