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T3: Trends and Challenges in VLSI Technology Scaling towards 100nm
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Source with EDA Technofair Design Automation Conference Asia and South Pacific archive
Proceedings of the 2002 conference on Asia South Pacific design automation/VLSI Design table of contents
Page: 16  
Year of Publication: 2002
ISBN:0-7695-1441-3
Authors
S. Rusu  Intel Corporation
M. Sachdev  University of Waterloo, Canada
C. Svensson  Linkoping University, Sweden
B. Nauta  University of Twente, The Netherlands
Sponsor
SIGDA: ACM Special Interest Group on Design Automation
Publisher
IEEE Computer Society  Washington, DC, USA
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